Datasheet FS6146-01 Datasheet (AMIS)

AMERICAN MICROSYSTEMS, INC.

April 2000

This document contains information on a preproduction product. Specifications and information herein are subject to change without notice.

4.26.00

FS6146

FS6146FS6146

FS6146

VCXO Clock Generator IC

VCXO Clock Generator ICVCXO Clock Generator IC

VCXO Clock Generator IC

Preliminar

y

Preliminar

y

Preliminar

y

Preliminar

y

ISO9001

ISO9001ISO9001

ISO9001

1.0 Features

• On-chip tunable voltage-controlled crystal oscillator

circuitry (VCXO) allows precise system frequency
tuning (pull range typically 300ppm)

• VCXO tuning range: 0-3V

• Uses inexpensive fundamental-mode crystals

• Integrated phase-locked loop (PLL) multiplies VCXO

frequency to the higher system frequencies needed

• 5V core supply voltage (contact factory for 3.3V)

• 3.3V / 5V output supply voltage

• Small circuit board footprint (8-pin 0.150″ SOIC)

• Custom frequency selections available - contact your

local AMI Sales Representative for more information

Figure 1: Pin Configuration

1 16

2

3

4

5

6

7

8

15

14

13

12

11

10

9

XIN

XOUT

VDD

XTUNE

VSS

n/c

OE

CLKA n/c

n/c

CLKB

VSS

VDDO

n/c

n/c

n/c

FS6146

16-pin (0.150″) SOIC

2.0 Description

The FS6146 is a monolithic CMOS clock generator IC
designed to minim ize cost a nd com ponen t coun t in d igital
video/audio systems.

At the core of the FS6146 is circu itry that implements a
voltage-controlled crystal oscillator when an external
resonator is attached. The VCXO allows device frequen­cies to be precisel y adjus ted for use in s ystem s that hav e
frequency matching r equir em ents, s uch as digit al satel lite
receivers.

A high-resolution ph ase-lock ed loop generates t he outpu t
clock frequencies (CL KA and CLKB). These f requencies
are phase-locked an d frequenc y-locked to t he VCXO fre­quency.

Table 1: Crystal / Output Frequencies

DEVICE f

XIN

(MHz) CLKA (MHz) CLKB (MHz)

FS6146-01 10.000 40.000 80.000

NOTE: Contact AMI for custom PLL frequencies

Figure 2: Block Diagram

VCXO

FS6146

PLL

XOUT

XIN

CLKA

XTUNE

Divider

Array

CLKB

AMERICAN MICROSYSTEMS, INC.

April 2000

2

4.26.00

FS6146

FS6146FS6146

FS6146

VCXO

V

CXOVCXO

V

CXO Clock Generator IC

Clock Generator ICClock Generator IC

Clock Generator IC

Preliminar

y

Preliminar

y

Preliminar

y

Preliminar

y

ISO9001

ISO9001ISO9001

ISO9001

Table 2: Pin Descriptions

Key: AI = Analog Input; AO = Analog Output; DI = Digital Input; DIU = Input with Internal Pull-Up; DID = Input with Internal Pull-Down; DIO = Digital Input/Output; DI-3 = Three-Level Digital Input,
DO = Digital Output; P = Power/Ground; # = Active Low pin

PIN TYPE NAME DESCRIPTION

1 AI XIN VCXO Crystal Feedback
2 AO XOUT / FREF VCXO Crystal Drive / External Reference Clock Input
3 P VDD Core Power Supply
4 AI XTUNE VCXO Tune Input
5 P VSS Ground
6 - N/C No Connection
7DIUOE Output Enable
8DOCLKAClock Output “A”

9 - N/C No Connection
10 - N/C No Connection
11 DO CLKB Clock Output “B”
12 P VSS Ground
13 P VDDO Output Power Supply (must be less than or equal to VDD)
14 - N/C No Connection
15 - N/C No Connection
16 - N/C No Connection

3.0 Functional Block Description

3.1 Phase-Locked Loop (PLL)

The on-chip PLL is a standard frequency- and phase­locked loop architecture. The PLL multiplies the r ef er ence
oscillator to the des ired frequency by a ratio of integers.
The frequency m ultiplication is exact with a zero synthe­sis error.

3.2 Voltage-Controlled Crystal
Oscillator (VCXO)

The VCXO provides a tunab le, low-jitter frequenc y refer­ence for the rest of the FS6146 system components.
Loading capacitance for the crystal is internal to the
FS6146. No external components ( other than the crystal
resonator itself) are required for operation of the VCXO.

Continuous fine-tuning of the VCXO fr equency is accom ­plished by varying the voltage on the XTUNE pin.

The oscillator operates t he crystal resonat or in the paral­lel-resonant m ode. Crystal warpin g, or the “p ulling” of the
crystal oscillation frequenc y, is accomplished by alteri ng

the effective load c apacitance presented t o the crystal b y
the oscillator circuit. T he actual am ount that changing th e
load capacitance alters the oscillator frequency will be
dependent on the charac teristics of the c rystal as well as
the oscillator circuit itself.

Specifically, the m otional capac itance of the cr ystal (usu­ally referred to by cr ystal manuf acturers as C

1

), the static

capacitance of the c rystal (C

0

), and the load capaci tance

(C

L

) of the oscillator det ermine the “warping” or “pulli ng”

capability of the crystal in the oscillator circuit.
A simple formula to obtain the warping capability of a

crystal oscillator is:

()

()()

CCCC

CCC

ppmf

LL

LL

1020

6

121

2

10

)(

+×+×

×−×

=∆

where CL1 and CL2 are the two extremes of the applied
load capacitance.

EXAMPLE: A crystal with the following parameters is
used. With C

1

= 0.02pF, C0 = 5pF, CL1 = 10pF, and CL2 =

22.66pF, the tuning range is

()

()()

ppm

.

..

f 305

105662252

10

6

106622020

=

+×+×

×−×

=∆

.

AMERICAN MICROSYSTEMS, INC.

April 2000

3

4.26.00

Preliminar

y

Preliminar

y

Preliminar

y

Preliminar

y

FS6146

FS6146FS6146

FS6146

VCXO Clock Generator IC

VCXO Clock Generator ICVCXO Clock Generator IC

VCXO Clock Generator IC

ISO9001

ISO9001ISO9001

ISO9001

4.0 Electrical Specifications

Table 3: Absolute Maximum Ratings

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at
these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance,
functionality, and reliability.

PARAMETER SYMBOL MIN. MAX. UNITS

Supply Voltage (VSS = ground) V

DD

VSS-0.5 7 V

Input Voltage, dc V

I

VSS-0.5 VDD+0.5 V

Output Voltage, dc V

O

VSS-0.5 VDD+0.5 V

Input Clamp Current, dc (VI < 0 or VI > VDD)I

IK

-50 50 mA

Output Clamp Current, dc (VI < 0 or VI > VDD)I

OK

-50 50 mA

Storage Temperature Range (non-condensing) T

S

-65 150 °C

Ambient Temperature Range, Under Bias T

A

-55 125 °C

Junction Temperature T

J

125 °C
Lead Temperature (soldering, 10s) 260 °C
Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7) 2 kV

CAUTION: ELECTROSTATIC SENSITIVE DEVICE

Permanent damage resulting in a loss of functionality or performance may occur if this devi ce is subjected to a high-energy elec­trostatic discharge.

Table 4: Operating Conditions

PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS

Supply Voltage V

DD

5V ± 10% 4.75 5 5.25 V

Ambient Operating Temperature Range T

A

070°C

Crystal Resonator Frequency f

XTAL

Fundamental Mode 5 13.5 18 MHz

Crystal Resonator Motional Capacitance C

1(xtal)

AT cut 25 fF

Crystal Loading Capacitance C

L(xtal)

AT cut 14 pF

AMERICAN MICROSYSTEMS, INC.

April 2000

4

4.26.00

FS6146

FS6146FS6146

FS6146

VCXO

V

CXOVCXO

V

CXO Clock Generator IC

Clock Generator ICClock Generator IC

Clock Generator IC

Preliminar

y

Preliminar

y

Preliminar

y

Preliminar

y

ISO9001

ISO9001ISO9001

ISO9001

Table 5: DC Electrical Specifications

Unless otherwise stated, VDD = 5V ± 10%, no load on any output, and ambient temperature range TA = 0°C to 70°C. Parameters denoted with an asterisk ( * ) represent nominal characterization data
and are not production tested to any specific limits. Where given, MIN and MAX characterization data are ± 3σ from typical. Negative currents indicate current flows out of the device.

PARAMETER SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS

Overall

Supply Current, Dynamic, with Loaded
Outputs

I

DD

f

XTAL

= 13.5MHz; CL = 10pF 20 mA

Voltage Controlled Crystal Oscillator - VDD=5.0V

Crystal Loading Capacitance C

L(xtal)

As seen by a crystal connected to XIN and
XOUT ( @ V

XTUNE

= 1.65V)

14 pF

Crystal Resonator Motional Capacitance C

1(xtal)

AT cut 25 fF

VCXO Tuning Range

f

XTAL

= 13.5MHz; C

L(xtal)

= 14pF; C

1(xtal)

= 25fF

300 ppm

VCXO Tuning Characteristic

Note: positive ∆F for positive ∆V

100 ppm/V

Crystal Drive Level

R

XTAL

=20Ω; C

L(xtal)

= 14pF

200 uW

Clock Outputs (CLKA, CLKB) - VDDO=3.3V

High-Level Output Source Current * I

OH

VO = 2.0V -40 mA

Low-Level Output Sink Current * I

OL

VO = 0.4V 17 mA

z

OH

VO = 0.1VDD; output driving high 25

Output Impedance *

z

OL

VO = 0.1VDD; output driving low 25

Ω

Short Circuit Source Current * I

OSH

VO = 0V; shorted for 30s, max. -55 mA

Short Circuit Sink Current * I

OSL

VO = 5V; shorted for 30s, max. 55 mA

Table 6: AC Timing Specifications

Unless otherwise stated, VDD = 5V ± 10%, no load on any output, and ambient temperature range TA = 0°C to 70°C. Parameters denoted with an asterisk ( * ) represent nominal characterization data
and are not production tested to any specific limits. Where given, MIN and MAX characterization data are ± 3σ from typical.

PARAMETER SYMBOL CONDITIONS/DESCRIPTION

CLOCK

(MHz)

MIN. TYP. MAX. UNITS

Overall

VCXO Stabilization Time * t

VCXOSTB

From power valid 10 ms

PLL Stabilization Time * t

PLLSTB

From VCXO stable 500 us

Output Frequency Synthesis Error (unless otherwise noted in Frequency Table) 0 ppm

Clock Output (CLK)

Duty Cycle *

Ratio of high pulse width (as measured from rising edge
to next falling edge at V

DD

/2) to one clock period

45 55 %

Jitter, Period (peak-peak) *

t

j(∆P)

From rising edge to next rising edge at
V

DD

/2, CL = 10pF

300 ps

Jitter, Long Term (σy(τ)) *

t

j(LT)

From 0-500µs at VDD/2, CL = 10pF
compared to ideal clock source

150 ps

Rise Time * t

r

VDD = 5V; VO = 0.5V to 4.5V; CL = 10pF ns

Fall Time * t

f

VDD = 5V; VO = 4.5V to 0.5V; CL = 10pF ns

AMERICAN MICROSYSTEMS, INC.

April 2000

5

4.26.00

Preliminar

y

Preliminar

y

Preliminar

y

Preliminar

y

FS6146

FS6146FS6146

FS6146

VCXO Clock Generator IC

VCXO Clock Generator ICVCXO Clock Generator IC

VCXO Clock Generator IC

ISO9001

ISO9001ISO9001

ISO9001

5.0 Package Information

Table 7: 16-pin SOIC (0.150") Package Dimensions

DIMENSIONS

INCHES MILLIMETERS

MIN. MAX. MIN. MAX.

A 0.061 0.068 1.55 1.73
A1 0.004 0.0098 0.102 0.249
A2 0.055 0.061 1.40 1.55

B 0.013 0.019 0.33 0.49

C 0.0075 0.0098 0.191 0.249

D 0.386 0.393 9.80 9.98

E 0.150 0.157 3.81 3.99

e 0.050 BSC 1. 27 BSC

H 0.230 0.244 5.84 6.20

h 0.010 0.016 0.25 0.41

L 0.016 0.035 0.41 0.89

Θ 0° 8° 0° 8°

Be

D

A

1

SEATING PLANE

HE

16

1

ALL RADII:

0.005" TO 0.01"

BASE PLANE

A

2

C

L

θ

7° typ.h x 45°

A

AMERICAN MICROSYSTEMS, INC.

R

Table 8: 16-pin SOIC (0.150") Package Characteristics

PARAMETER SYMBOL CONDITIONS/DESCRIPTION TYP. UNITS

Thermal Impedance, Junction to Free-Air
16-pin 0.150” SOIC

Θ

JA

Air flow = 0 m/s 109 °C/W
Corner lead 4.0

Lead Inductance, Self L

11

Center lead 3.0

nH

Lead Inductance, Mutual L

12

Any lead to any adjacent lead 0.4 nH

Lead Capacitance, Bulk C

11

Any lead to V

SS

0.5 pF

AMERICAN MICROSYSTEMS, INC.

April 2000

6

4.26.00

FS6146

FS6146FS6146

FS6146

VCXO

V

CXOVCXO

V

CXO Clock Generator IC

Clock Generator ICClock Generator IC

Clock Generator IC

Preliminar

y

Preliminar

y

Preliminar

y

Preliminar

y

ISO9001

ISO9001ISO9001

ISO9001

6.0 Ordering Information

Table 9: Device Ordering Codes

ORDERING CODE DEVICE NUMBER PACKAGE TYPE

OPERATING

TEMPERATURE RANGE

SHIPPING

CONFIGURATION

11640-823

FS6146-01

8-pin (0.150”) SOIC

(Small Outline Package)

0°C to 70°C (Commer cial)

Tape and Reel

11640-833

FS6146-01

8-pin (0.150”) SOIC

(Small Outline Package)

0°C to 70°C (Commer cial)

Tubes

7.0 Revision Information

DATE PAGE DESCRIPTION

4/26/00 2 Fixed formatting errors

Copyright © 1999, 2000 American Microsystems, Inc.

Devices sold by AMI are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMI
makes no warranty, express, statutory implied or by description, regarding the information set forth herein or regarding the freedom
of the described devices from patent infringement. AMI makes no warranty of merchantability or fitness for any purposes. AMI re­serves the right to discontinue production and change specifications and prices at any time and without notice. AMI’s products are
intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental require­ments, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recom ­mended without additional processing by AMI for such applications.

American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, ID 83201, [phone], FAX [phone],
WWW Address: http://www.amis.com E-mail: [e-mail]