Power MOS V® is a new generation of high voltage N-Channel enhancement
FREDFET
TO-264
mode power MOSFETs. This new technology minimizes the JFET effect,
increases packing density and reduces the on-resistance. Power MOS V
®
also achieves faster switching speeds through optimized gate layout.
• Fast Recovery Body Diode• 100% Avalanche Tested
D
• Lower Leakage• Popular TO-264 Package
• Faster Switching
G
S
MAXIMUM RATINGSAll Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
TJ,T
STG
T
L
I
AR
E
AR
E
AS
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
Pulsed Drain Current
Gate-Source Voltage Continuous
Gate-Source Voltage Transient
Total Power Dissipation @ TC = 25°C
Linear Derating Factor
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
Avalanche Current
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
On State Drain Current
Drain-Source On-State Resistance
Zero Gate Voltage Drain Current (VDS = V
Zero Gate Voltage Drain Current (V
Gate-Source Leakage Current (VGS = ±30V, V
Gate Threshold Voltage (VDS = VGS, ID = 2.5mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
2
(V
DS
APT Website - http://www.advancedpower.com
= 0V, ID = 250µA)
GS
> I
x R
D(on)
2
(VGS = 10V, 0.5 I
= 0.8 V
DS
Max, VGS = 10V)
DS(on)
D[Cont.]
, VGS = 0V)
DSS
, VGS = 0V, TC = 125°C)
DSS
= 0V)
DS
)
MINTYPMAX
600
38
0.150
24
250
1000
±100
UNIT
Volts
Amps
Ohms
µA
nA
Volts
050-5945 Rev- 1-2000
Page 2
DYNAMIC CHARACTERISTICS
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
td(on)
t
r
td(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V
VDS = 25V
f = 1 MHz
V
GS
V
= 0.5 V
DD
ID = I
[Cont.] @ 25°C
D
V
GS
V
= 0.5 V
DD
ID = I
[Cont.] @ 25°C
D
R
G
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
= 0V
GS
= 10V
= 15V
= 0.6W
DSS
DSS
APT6015LVFR
MINTYPMAX
75009000
9001260
320480
315475
4570
125190
1530
1326
4570
510
UNIT
pF
nC
ns
Symbol
I
I
SM
V
dv
t
Q
I
RRM
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
Pulsed Source Current
Diode Forward Voltage
SD
Peak Diode Recovery dv/
/
dt
1
(Body Diode)
2
dt
Reverse Recovery Time
rr
= -ID [Cont.], di/dt = 100A/µs)
(I
S
Reverse Recovery Charge
rr
(IS = -ID [Cont.], di/dt = 100A/µs)
Peak Recovery Current
(IS = -ID [Cont.], di/dt = 100A/µs)
(VGS = 0V, IS = -ID [Cont.])
5
T
= 25°C250
j
T
= 125°C500
j
T
= 25°C1.6
j
T
= 125°C5.5
j
T
= 25°C15
j
T
= 125°C27
j
THERMAL CHARACTERISTICS
Symbol
R
R
1
Repetitive Rating: Pulse width limited by maximum junction
temperature.
2
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
qJC
Junction to Ambient
PRELIMINARY
qJA
3
See MIL-STD-750 Method 3471
4
Starting T
5
IS £ ID [Cont.],
+25°C, L = 3.46mH, R
j
=
di
/
= 100A/µs, T
dt
MINTYPMAX
38
152
1.3
5
MINTYPMAX
0.24
40
25W, Peak IL = 38A
G
=
150°C, R
j
£
= 2.0W, VR = 200V.
G
UNIT
Amps
Volts
V/ns
ns
µC
Amps
UNIT
°C/W
050-5945 Rev- 1-2000
0.3
0.1
0.05
0.01
0.005
, THERMAL IMPEDANCE (°C/W)
JC
q
Z
0.001
-5
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
D=0.5
0.2
0.1
0.05
0.02
0.01
-4
10
SINGLE PULSE
10
RECTANGULAR PULSE DURATION (SECONDS)
-3
-2
10
-1
10
1.010
Page 3
APT6015LVFR
100
80
VGS=6V, 7V, 10V & 15V
5.5V
100
80
VGS=6V, 7V, 10V & 15V
5.5V
60
40
20
, DRAIN CURRENT (AMPERES)
D
0
050100150200250300048121620
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)