Page 1
APT5015BVR
500V 32A 0.150Ω
POWER MOS V
®
Power MOS V® is a new generation of high voltage N-Channel enhancement
mode power MOSFETs. This new technology minimizes the JFET effect,
increases packing density and reduces the on-resistance. Power MOS V
®
also achieves faster switching speeds through optimized gate layout.
• Faster Switching • 100% Avalanche Tested
• Lower Leakage • Popular TO-247 Package
MAXIMUM RATINGS All Ratings: T C = 25° C unless otherwise specified.
Symbol
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
TJ,T
STG
T
L
I
AR
E
AR
E
AS
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
Pulsed Drain Current
1
= 25° C
C
Gate-Source Voltage Continuous
Gate-Source Voltage Transient
Total Power Dissipation @ T
= 25° C
C
Linear Derating Factor
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
1
Avalanche Current
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
(Repetitive and Non-Repetitive)
1
4
APT5015BVR
TO-247
G
500
32
128
±30
±40
370
2.96
-55 to 150
300
32
30
1300
D
S
UNIT
Volts
Amps
Volts
Watts
W/° C
° C
Amps
mJ
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33)5 579215 15 FAX: (33) 556 47 9761
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
On State Drain Current
2
Drain-Source On-State Resistance
Zero Gate Voltage Drain Current (VDS = V
Zero Gate Voltage Drain Current (V
Gate-Source Leakage Current (V
(V
DS
= 0V, ID = 250µ A)
GS
> I
x R
D(on)
2
(VGS = 10V, 0.5 I
= 0.8 V
DS
= ± 30V, V
GS
Max, VGS = 10V)
DS(on)
D[Cont.]
, VGS = 0V)
DSS
, VGS = 0V, TC = 125° C)
DSS
= 0V)
DS
)
Gate Threshold Voltage (VDS = VGS, ID = 1.0mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
MIN TYP MAX
500
32
24
0.150
25
250
± 100
UNIT
Volts
Amps
Ohms
µ A
nA
Volts
050-5561 Rev C
Page 2
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θ JC
+ T
C
t
1
t
2
P
DM
DYNAMIC CHARACTERISTICS
APT5015BVR
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V
VDS = 25V
f = 1 MHz
V
GS
VDD = 0.5 V
ID = I
D[Cont.]
VGS = 15V
VDD = 0.5 V
ID = I
D[Cont.]
RG = 1.6Ω
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
I
SM
V
t
Q
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
1
Pulsed Source Current
Diode Forward Voltage 2 (VGS = 0V, IS = -I
SD
Reverse Recovery Time (I
rr
Reverse Recovery Charge (I
rr
(Body Diode)
S
= -I
S
D[Cont.]
= -I
D[Cont.]
, dlS/dt = 100A/µ s)
, dlS/dt = 100A/µ s)
D[Cont.]
)
= 0V
GS
= 10V
DSS
@ 25° C
DSS
@ 25° C
MIN TYP MAX
4400 5280
600 840
230 350
200 300
30 45
80 120
12 25
14 30
55 80
11 20
MIN TYP MAX
32
128
1.3
510
10.2
UNIT
pF
nC
ns
UNIT
Amps
Volts
ns
µ C
050-5561 Rev C
THERMAL CHARACTERISTICS
Symbol
R
θ JC
R
θ JA
1
Repetitive Rating: Pulse width limited by maximum junction
temperature.
2
Pulse Test: Pulse width < 380 µ S, Duty Cycle < 2%
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
Junction to Ambient
0.4
0.1
0.05
0.01
0.005
, THERMAL IMPEDANCE (° C/W)
JC
θ
Z
0.001
-5
10
3
See MIL-STD-750 Method 3471
4
Starting T
D=0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
-4
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
-3
10
RECTANGULAR PULSE DURATION (SECONDS)
-2
10
+25° C, L = 2.54mH, R
j
=
-1
10
MIN TYP MAX
0.34
40
25Ω , Peak IL = 32A
G
=
1.0 10
UNIT
°C/W
Page 3
APT5015BVR
60
50
40
VGS=6V, 7V, 8V, 10V & 15V
5.5V
60
50
40
VGS=7V, 8V & 10V
VGS=15V
6V
5.5V
30
30
5V
20
, DRAIN CURRENT (AMPERES)
10
D
0
05 01 0 01 5 02 0 02 5 0 024681 01 2
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
4.5V
4V
20
, DRAIN CURRENT (AMPERES)
10
D
0
FIGURE 2, TYPICAL OUTPUT CHARACTERISTICS FIGURE 3, TYPICAL OUTPUT CHARACTERISTICS
60
VDS> ID (ON) x RDS (ON)MAX.
50
250µ SEC. PULSE TEST
@ <0.5 % DUTY CYCLE
TJ = -55° C
TJ = +125° C
40
30
20
, DRAIN CURRENT (AMPERES) I
10
D
0
FIGURE 4, TYPICAL TRANSFER CHARACTERISTICS FIGURE 5, RDS(ON) vs DRAIN CURRENT
TJ = +125° C
TJ = +25° C
02468 02 04 06 08 0
V
, GATE-TO-SOURCE VOLTAGE (VOLTS) ID, DRAIN CURRENT (AMPERES)
GS
TJ = -55° C
35
1.5
1.4
NORMALIZED TO
V
= 10V @ 0.5 ID [Cont.]
GS
1.3
1.2
1.1
VGS=10V
VGS=20V
1.0
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.9
DS
1.15
5V
4.5V
4V
30
25
1.10
1.05
20
1.00
15
, DRAIN-TO-SOURCE BREAKDOWN R
0.95
0.90
DSS
0.85
1.2
1.1
10
, DRAIN CURRENT (AMPERES) I
D
5
0
25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
T
, CASE TEMPERATURE (° C) TJ, JUNCTION TEMPERATURE (° C)
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
2.5
C
ID = 0.5 ID [Cont.]
VGS = 10V
2.0
1.0
1.5
0.9
1.0
(NORMALIZED)
0.5
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.0
DS
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
R
T
, JUNCTION TEMPERATURE (° C) TC, CASE TEMPERATURE (° C)
J
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
0.8
(NORMALIZED) VOLTAGE (NORMALIZED)
(TH), THRESHOLD VOLTAGE BV
0.7
GS
V
0.6
050-5561 Rev C
Page 4
200
100
OPERATION HERE
LIMITED BY RDS (ON)
50
10
5
1
TC =+25° C
.5
, DRAIN CURRENT (AMPERES)
D
TJ =+150° C
SINGLE PULSE
10µ S
100µ S
1mS
10mS
100mS
DC
20,000
10,000
5,000
1,000
500
APT5015BVR
C
iss
C
oss
C
rss
.1
1 5 10 50 100 500 .01 .1 1 10 50
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 10, MAXIMUM SAFE OPERATING AREA FIGURE 11, TYPICAL CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
20
ID = ID [Cont.]
16
12
8
4
, GATE-TO-SOURCE VOLTAGE (VOLTS) I
GS
V
0
0 50 100 150 200 250 300 350 0 0.4 0.8 1.2 1.6 2.0
Q
, TOTAL GATE CHARGE (nC) VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE FIGURE 13, TYPICAL SOURCE-DRAIN DIODE FORWARD VOLTAGE
g
VDS=100V
VDS=250V
VDS=400V
100
300
100
T
50
10
5
, REVERSE DRAIN CURRENT (AMPERES) C, CAPACITANCE (pF)
DR
1
I
J
=+150° C T
J
=+25° C
TO-247 Package Outline
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
6.15 (.242) BSC
15.49 (.610)
16.26 (.640)
5.38 (.212)
6.20 (.244)
20.80 (.819)
21.46 (.845)
Drain
4.50 (.177) Max.
0.40 (.016)
0.79 (.031)
2.21 (.087)
2.59 (.102)
19.81 (.780)
20.32 (.800)
1.01 (.040)
1.40 (.055)
5.45 (.215) BSC
2-Plcs.
Dimensions in Millimeters and (Inches)
APT's devices are covered by one or more of the following U.S.patents: 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336
050-5561 Rev C
5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058
3.50 (.138)
3.81 (.150)
2.87 (.113)
3.12 (.123)
1.65 (.065)
2.13 (.084)
Gate
Drain
Source