Datasheet 74F38SJX, 74F38SJ, 74F38SCX, 74F38SC, 74F38PC Datasheet (Fairchild Semiconductor)

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© 1999 Fairchild Semiconductor Corporation DS009465 www.fairchildsemi.com
April 1988 Revised November 1999
74F38 Quad Two-Input NAND Buffer (Open Collector)
74F38 Quad Two-Input NAND Buffer (Open Collector)
General Description
This device contains four independent gates, each of which performs the logic NA ND functio n. The open -collector out­puts require external pull-up resistors for proper logical operation.
Ordering Code:
Devices also availab le in Tape and Reel. Specify by appending th e s uffix let t er “X” to the ordering code.
Logic Symbol
IEEE/IEC
Connection Diagram
Unit Loading/Fan Out
Note 1: OC = Open Collector
Function Table
H = HIGH Voltage Level L = LOW Voltage Level
Order Number Package Number Package Description
74F38SC M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150 Narrow 74F38SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F38PC N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Pin Names Description
U.L. Input I
IH/IIL
HIGH/LOW Output IOH/I
OL
An, B
n
Inputs 1.0/2.0 20 µA/1.2 mA
O
n
Outputs OC (Note 1) /106.6 OC (Note 1) /64 mA
Inputs Output
AB O
LL H LH H HL H HH L
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74F38
Absolute Maximum Ratings(Note 2) Recommended Operating
Conditions
Note 2: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation under these conditi ons is not implied.
Note 3: Either voltage lim it or c urrent limit is sufficient to protect inputs.
DC Electrical Characteristics
AC Electrical Characteristics
Storage Temperature −65°C to +150°C Ambient Temperature under Bias 55°C to +125°C Junction Temperature under Bias −55°C to +150°C V
CC
Pin Potential to Ground Pin 0.5V to +7.0V Input Voltage (Note 3) 0.5V to +7.0V Input Current (Note 3) 30 mA to +5.0 mA Voltage Applied to Output
in HIGH State (with V
CC
= 0V)
Standard Output 0.5V to V
CC
3-STATE Output 0.5V to +5.5V
Current Applied to Output
in LOW State (Max) twice the r ated I
OL
(mA)
Free Air Ambient Temperature 0°C to +70°C Supply Voltage +4.5V to +5.5V
Symbol Parameter Min Typ Max Units
V
CC
Conditions
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage −1.2 V Min IIN = 18 mA
V
OL
Output LOW 10% V
CC
0.55 V Min IOL = 64 mA
Voltage
I
IH
Input HIGH
5.0 µAMaxVIN = 2.7V
Current
I
BVI
Input HIGH Current
7.0 µAMaxVIN = 7.0V
Breakdown Test
V
ID
Input Leakage
4.75 V 0.0
IID = 1.9 µA
Test All Other Pins Grounded
I
OD
Output Leakage
3.75 µA0.0
V
IOD
= 150 mV
Circuit Current All Other Pins Grounded
I
IL
Input LOW Current −1.2 mA Max VIN = 0.5V
I
OHC
Open Collector, Output
250 µAMinV
OUT
= V
CC
OFF Leakage Test
I
CCH
Power Supply Current 2.1 7.0 mA Max VO = HIGH
I
CCL
Power Supply Current 26.0 30.0 mA Max VO = LOW
Symbol Parameter
TA = +25°CT
A
= 0°C to +70°C
Units
VCC = +5.0V VCC = +5.0V
CL = 50 pF CL = 50 pF
Min Typ Max Min Max
t
PLH
Propagation Delay 6.5 9.7 12.5 6.5 13.0
ns
t
PHL
An, Bn to O
n
1.5 2.1 5.0 1.5 5.5
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74F38
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150 Narrow
Package Number M14A
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74F38
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
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74F38 Quad Two-Input NAND Buffer (Open Collector)
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Package Number N14A
Fairchild does not assume any responsibility for use of any circuitry described , no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are dev ic es or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provide d in the labe l ing, can be re a­sonably expected to result in a significant injury to the user.
2. A critical compo nent in any com ponen t of a life s upp ort device or system whose failure to perform can be rea­sonably expected to cause the failure of the l ife support device or system, or to affect its safety or effectiveness.
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