Datasheet 5962-9325001MSA, 5962-9325001MRA, 54F2244LMQB Datasheet (NSC)

Page 1
TL/F/9499
54F/74F2244 Octal Buffer/Line Driver with 25X Series Resistors in Outputs
August 1995
54F/74F2244 Octal Buffer/Line Driver with 25X Series Resistors in Outputs
General Description
The ’F2244 is an octal buffer/line driver designed to drive the capacitive inputs of MOS memory drivers, address driv­ers, clock drivers and bus-oriented transmitters/receivers.
The 25X series resistors in the outputs reduce ringing and eliminate the need for external resistors.
Features
Y
TRI-STATEÉoutputs drive bus lines or buffer memory address registers
Y
12 mA source current
Y
25X series resistors in outputs eliminate the need for external resistors.
Y
Designed to drive the capacitive inputs of MOS devices
Y
Guaranteed 4000V minimum ESD protection
Commercial Military
Package
Package Description
Number
74F2244PC N20B 20-Lead (0.300×Wide) Molded Dual-In-Line
54F2244DM (Note 2) J20A 20-Lead Ceramic Dual-In-Line
74F2244SC (Note 1) M20B 20-Lead (0.300×Wide) Molded Small Outline JEDEC
74F2244MSA (Note 1) MSA20 20-Lead Molded Shrink Small Outline EIAJ Type II
54F2244FM (Note 2) W20A 20-Lead Cerpak
54F2244LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carier, Type C
Note 1: Devices also available in 13×reel. Use suffixeSCX and MSAX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix
e
DMQB, FMQB and LMQB.
Connection Diagrams
Pin Assignment for LCC
’F2244
TL/F/9499– 3
Pin Assignment for DIP, SOIC and SSOP
’F2244
TL/F/9499– 4
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.
Page 2
Logic Symbol
IEEE/IEC
’F2244
TL/F/9499– 6
Unit Loading/Fan Out
54F/74F
Pin Names Description
U.L. Input I
IH/IIL
HIGH/LOW Output IOH/I
OL
OE1,OE
2
TRI-STATE Output Enable Input (Active LOW) 1.0/1.667 20 mA/b1mA
OE
2
TRI-STATE Output Enable Input (Active HIGH) 1.0/1.667 20 mA/b1mA
I
an,Ibn
Inputs 1.0/2.667* 20 mA/b1.6 mA
Oan,O
bn
Outputs 750/20
b
15 mA/12 mA
*Worst-case ’F2244 disabled
Truth Table
’F2244
OE
1
I
an
O
an
OE
2
I
bn
O
bn
HXZ HXZ LHH LHH LLL LLL
H
e
HIGH Voltage Level
L
e
LOW Voltage Level
X
e
Immaterial
Z
e
High Impedance
2
Page 3
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Storage Temperature
b
65§Ctoa150§C
Ambient Temperature under Bias
b
55§Ctoa125§C
Junction Temperature under Bias
b
55§Ctoa175§C
Plastic
b
55§Ctoa150§C
V
CC
Pin Potential to
Ground Pin
b
0.5V toa7.0V
Input Voltage (Note 2)
b
0.5V toa7.0V
Input Current (Note 2)
b
30 mA toa5.0 mA
Voltage Applied to Output
in HIGH State (with V
CC
e
0V)
Standard Output
b
0.5V to V
CC
TRI-STATE Output
b
0.5V toa5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
Recommended Operating Conditions
Free Air Ambient Temperature
Military
b
55§Ctoa125§C
Commercial 0
§
Ctoa70§C
Supply Voltage
Military
a
4.5V toa5.5V
Commercial
a
4.5V toa5.5V
DC Electrical Characteristics
Symbol Parameter
54F/74F
Units V
CC
Conditions
Min Typ Max
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage
b
1.2 V Min I
IN
eb
18 mA
V
OH
Output HIGH 54F 10% V
CC
2.4 I
OH
eb
3mA
Voltage 54F 10% V
CC
2.0 I
OH
eb
12 mA
74F 10% V
CC
2.4 V Min
I
OH
eb
3mA
74F 10% V
CC
2.0 I
OH
eb
15 mA
74F 5% V
CC
2.7 I
OH
eb
3mA
V
OL
Output LOW 0.50
V Min
I
OL
e
1mA
Voltage 0.75 I
OL
e
12 mA
I
IH
Input HIGH 54F 20.0
mA Max V
IN
e
2.7V
Current 74F 5.0
I
BVI
Input HIGH Current 54F 100
mA Max V
IN
e
7.0V
Breakdown Test 74F 7.0
I
CEX
Output HIGH 54F 250
mA Max V
OUT
e
V
CC
Leakage Current 74F 50
V
ID
Input Leakage
74F 4.75 V 0.0
I
ID
e
1.9 mA
Test All other pins grounded
I
OD
Output Leakage
74F 3.75 mA 0.0
V
IOD
e
150 mV
Circuit Current All other pins grounded
I
IL
Input LOW Current
b
1.0 mA Max
V
IN
e
0.5V (OE1,OE2,OE2)
b
1.6 V
IN
e
0.5V (In)
I
OZH
Output Leakage Current 50 mA Max V
OUT
e
2.7V
I
OZL
Output Leakage Current
b
50 mA Max V
OUT
e
0.5V
I
OS
Output Short-Circuit Current
b
100
b
225 mA Max V
OUT
e
0V
I
CCH
Power Supply Current 40 60 mA Max V
O
e
HIGH
I
CCL
Power Supply Current 60 90 mA Max V
O
e
LOW
I
CCZ
Power Supply Current 60 90 mA Max V
O
e
HIGH Z
3
Page 4
AC Electrical Characteristics
74F 54F 74F
T
A
ea
25§C
T
A,VCC
e
Mil TA,V
CC
e
Com
Symbol Parameter V
CC
ea
5.0V C
L
e
50 pF C
L
e
50 pF
Units
C
L
e
50 pF
Min Typ Max Min Max Min Max
t
PLH
Propagation Delay 1.5 7.0 2.0 6.5 1.5 7.0
ns
t
PHL
Data to Output 2.5 8.0 2.0 7.0 2.0 8.0
t
PZH
Output Enable Time 1.5 9.0 2.0 7.0 1.0 9.5
t
PZL
2.5 11.5 2.0 8.5 2.5 12.0 ns
t
PHZ
Output Disable Time 1.5 9.0 2.0 7.0 1.0 9.5
t
PLZ
1.5 8.5 2.0 7.5 1.5 9.5
Ordering Information
The device number is used to form part of a simplified purchasing code where a package type and temperature range are defined as follows:
74F 2244 S C X
Temperature Range Family Special Variations
74F
e
Commercial QBeMilitary grade device with
54F
e
Military environmental and burn-in
processing
Device Type
X
e
Devices shipped in 13×reel
Package Code
Temperature Range
P
e
Plastic DIP
C
e
Commercial (0§Ctoa70§C)
D
e
Ceramic DIP
M
e
Military (b55§Ctoa125§C)
S
e
Small Outline Package (SOIC)
MSA
e
Shrink Small Outline Package SOIC EIAJ Type II (74F244 only)
L
e
Leadless Chip Carrier (LCC)
F
e
Flatpak
4
Page 5
5
Page 6
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier, Type C (L)
NS Package Number E20A
20-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J20A
6
Page 7
Physical Dimensions inches (millimeters) (Continued)
20-Lead Molded Shrink Small Outline Package, EIAJ Type II (MSA)
NS Package Number MSA20
20-Lead (0.300×Wide) Molded Dual-In-Line Package (P)
NS Package Number N20B
7
Page 8
54F/74F2244 Octal Buffer/Line Driver with 25X Series Resistors in Outputs
Physical Dimensions inches (millimeters) (Continued)
20-Lead Cerpak (F)
NS Package Number W20A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user.
National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.
1111 West Bardin Road Fax: (
a
49) 0-180-530 85 86 13th Floor, Straight Block, Tel: 81-043-299-2309 Arlington, TX 76017 Email: cnjwge@tevm2.nsc.com Ocean Centre, 5 Canton Rd. Fax: 81-043-299-2408 Tel: 1(800) 272-9959 Deutsch Tel: (
a
49) 0-180-530 85 85 Tsimshatsui, Kowloon Fax: 1(800) 737-7018 English Tel: (
a
49) 0-180-532 78 32 Hong Kong
Fran3ais Tel: (
a
49) 0-180-532 93 58 Tel: (852) 2737-1600
Italiano Tel: (
a
49) 0-180-534 16 80 Fax: (852) 2736-9960
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
Loading...