ANPEC APL5523 Service Manual

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APL5523
Dual-Channel, 3.3V/500mA and 1.8V/300mA Linear Regulator
Features General Description
••
Fixed Output Voltage :
••
VOUT1=3.3V/500mA VOUT2=1.8V/300mA
••
Low Dropout Voltage (defined as the minimum
••
input/output voltage difference): Output 1 Dropout Voltage : 0.6V (at 500mA) Output 2 Dropout Voltage : 0.9V (at 300mA)
••
Stable with 4.7uF Output Capacitor(at VOUT1)
••
Stable with 2.2uF Output Capacitor(at VOUT2)
••
Built in Thermal Protection
••
••
Built in Current Limit Protection
••
••
Fast transient Response
••
••
Short Setting Time
••
••
SOP-8 and SOP-8-P Package Available
••
Applications
Desktop Computer
Networking Systems
Optical Data Storage Systems
lator comes in a SOP-8 and SOP-8-P package.
Pin Configuration
SOP8 (Top View)
OUT1
V
V
OUT2
1
IN
2
V
IN
V
3 4
= Thermal Pad
(connected to GND plane for better heat dissipation)
SOP-8-P (Top View)
8
7 6 5
GND
GND
GND GND
V
V
OUT1
V
V
OUT2
1
IN
2
IN
3 4
8
NC
GND
7
6
NC
5
NC
Ordering and Marking Information
APL5523
Lead Free Code Handling Code
Tem p. Range Package Code
APL5523 K/KA :
APL5523 XXXXX
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2004
Package Code K : S OP-8 K A : S O P-8-P Operating Junction Tem p. Range C : 0 to 1 5 0° C Handling Code TU : Tube TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device
XXXXX - Date Code
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APL5523
Pin Description
PIN
No. Name
1 V
OUT1
O V
I/O Description
OUT1
output Voltage 3.3V. sources up to 500 mA. 2 VIN I Supply Voltage. 3 VIN I Supply Voltage. 4 V
OUT2
O V
OUT2
output Voltage 1.8V. sources up to 300 mA. 5 GND 6 GND 7 GND
Ground also functions as a heatsink. Solder to the ground plane to maximize thermal dissipation
8 GND
Absolute Maximum Ratings
Symbol Parameter Rating Unit
OUT
VIN, V
R
R
Input Voltage or Ou t Voltage 6 V
TH,JA
Thermal Resistance – Junction to Ambient
TH,JC
PD
TJ
SOP-8 150 SOP-8-P 75 Thermal Resistance – Junction to Case SOP-8 30 SOP-8-P 5 Po w e r Dissipation Inte rn a lly L imited W Operating Junction Temperature
°C/W
°C/W
°C
Control Section 0 to 125 Power Transistor 0 to 150
TST G Storage Temperature Range -65 to +150
TL Lead Temperature (Soldering, 10 second) 260
°C °C
Electrical Characteristics
Unless otherwise noted these specifications apply over full temperature, CIN=1µF, COUT1=4.7µF, COUT2=2.2µF, TJ=0 to 125°C. Typical values refer to TJ=25°C.
Symbol Parameter Test Conditions
VIN Input Voltage 2.7 6 V
SHORT
I
Short Current V
OTS
Over Temperature Shutdown
Over Temperature Shutdown Hysteresis
=0V 50 mA
OUT
150 °C
Hysteresis 20 °C
Output Voltage
TC
Temperature
100 ppm/°C
Coefficient
I
IQ Quiescent Current
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2004
OUT1
I
OUT1
=500mA, I
=0mA, I
=300mA 900 1000
OUT2
=0mA 100 200
OUT2
APL5523
Min. Typ. Max.
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Unit
µA
APL5523
Electrical Characteristics (Cont.)
Unless otherwise noted these specifications apply over full temperature, CIN=1µF, COUT1=4.7µF, C
OUT2=2.2µF, T
Symbol Parameter Test Conditions
Output1 (500mA)
V
Output Voltage VIN=5V
OUT
I
Circuit Current Limit
LIMIT
I
OUT
REG
REG
Line Regulation V
LINE
LOAD
PSRR Ripple Rejection F1kHz, 1Vpp at I V
Dropout Voltage
DROP
C
Output Capacitor 4.7 µF
OUT
ESR 0.01 0.1 1 Ohm
Output2(300mA)
V
Output Voltage VIN=5V
OUT
I
Circuit Current Limit
LIMIT
I
OUT
REG
REG
Line Regulation V
LINE
LOAD
PSRR Ripple Rejection F1kHz, 1Vpp at I V
Dropout Voltage
DROP
C
Output Capacitor 2.2 µF
OUT
ESR 0.01 0.1 1 Ohm
Note1 : Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT+1V
=0 to 125°C. Typical values refer to TJ=25°C.
J
IN=VOUT
V
Load Current
VIN=V
OUT
Load Regulation VIN =V
(Note1)
I
OUT
IN=VOUT
V
Load Current
VIN=V
OUT
Load Regulation VIN =V
(Note1)
I
OUT
+1V
OUT
+1V 500 mA
+1V< VCC<6.0V, I
+1V, 0mA< I
OUT
=500mA 0.6 0.7 V
+1V
OUT
+1V 300 mA
+1V< VCC<6.0V, I
+1V, 0mA< I
OUT
=300mA 0.9 1 V
APL5523
Min. Typ. Max.
V
OUT
-2%
3.3
V
OUT
+2%
Unit
V
900 mA
=1mA 5 10 mV
OUT
-2%
40
1.8
60 mV
V
OUT
+2%
V
< I
OUT
MAX
=50mA 40 48 dB
OUT
V
OUT
900 mA
=1mA 4 10 mV
OUT
< I
OUT
MAX
=50mA 45 55 dB
OUT
20
40
mV
Application Circuit
OUT1
V
4.7µF
V
IN
V
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2004
OUT2
1
2
F
3
4
µ
F
2.2 APL5523
8
7
6
5
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APL5523
Typical Characteristics
Quiescent Current vs. Input Voltage
160
I
140
120 100
80 60
40
Quiescent Current (µA)
20
0
0123456
OUT1=IOUT2
=0mA
Input Voltage (V)
Output Voltage vs. Input Voltage
3.5
3
I
OUT1=IOUT2
=0mA
V
OUT1
Quiescent Current vs. Output Current
600
OUT1
500
V
OUT2
400
300
200
Quiescent Current (µA)
100
0
0 100 200 300 400 500
Output Current (mA)
Output1 Voltage vs. Temperature
3.310
3.305
I
OUT1
VIN=5VV
=0m A
2.5
2
1.5
1
Output Voltage (V)
0.5
0
012345
Input Voltage (V)
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2004
3.300
3.295
V
OUT2
3.290
Output1 Voltage (V)
3.285
3.280
-40-20020406080100120140
T emperature (°C)
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APL5523
Typical Characteristics
Output2 Voltage vs. Temperature
1.804
I
OUT2
1.802
1.800
1.798
1.796
Output2 Voltage (V)
1.794
1.792
-40-200 20406080100120140
T emperature (°C)
PSRR vs. Frequency
=0m A
Dropout Voltage vs. Output Current
1000
900 800 700 600 500 400 300 200
Dropout Voltage (mV)
100
0
V
OUT2
V
OUT1
0 100 200 300 400 500
Output Current (mA)
Load-Transient Response
0
VIN = 5V
-10
IOUT1 = IOUT2 = 50mA
-20
-30
-40
-50
PSRR (dB)
-60
-70
-80
10
100 1k 10k
Frequency (Hz)
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2004
VOUT1
VOUT2
100k
VOUT1(100mv/div)
IOUT1=1mA~500mA COUT1=4.7uF(Aluminum) Tr=1us
Time (0.1ms/div)
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APL5523
Typical Characteristics
Load-Transient Response
VOUT2(100mv/div)
IOUT2=1mA~300mA C
OUT2=2.2uF(Aluminum)
Tr=1us
Time(0.1ms/div)
Output Curretn vs. VIN
450
Mounted on recommend mimimum footprint(RθJA=75°C/W)
400
, 2OZ Copper PCB area.(TJ,MAX=150°C )
350
Line-Transient Response
VIN = 4.5 ~ 5.5V
VOUT1(20mV/div)
OUT1=10mA
I C
OUT1=4.7uF
VOUT2(20mV/div) IOUT2=10mA COUT2=2.2uF
Time(20µs/div)
300
250
200
150
Output Current mA)
100
50
0
4.75 5 5.25 5.5 5.75 6
TA=25°C
TA=55°C
VIN (V)
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2004
20mil
200mil
100mil
20mil
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APL5523
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
HE
0.015X45
e1 e2
D
A1
A
1
L
0.004max.
Dim
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
D 4.80 5.00 0.189 0.197
E 3.80 4.00 0.150 0.157
H 5.80 6.20 0.228 0.244
L 0.40 1.27 0.016 0.050 e1 0.33 0.51 0.013 0.020 e2 1.27BSC 0.50BSC
18
φ
Millimeters Inches
Min. Max. Min. Max.
°
8
°
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2004
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APL5523
Packaging Information
SOP-8-P pin ( Reference JEDEC Registration MS-012)
E1
HE
0.015X45
D1
e1 e2
D
A1
A
1
L
0.004max.
Dim
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
D 4.80 5.00 0.1 89 0.197
D1
E 3.80 4.00 0.150 0.157
E1 2.60REF 0.102REF
H 5.80 6.20 0.2 28 0.244
L 0.40 1.27 0.016 0.050
e1 0.33 0.51 0.013 0.020 e2 1.27BSC 0.50BSC
φ 18° 8°
Millimeters Inches
Min. Max. Min. Max.
3.00REF
0.118REF
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2004
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APL5523
Physical Specifications
Terminal Material Solder-P lated C opp er (S olde r M a terial : 90/10 or 63 /37 S nPb) , 100 %Sn Lead Solderability Meets EIA Spec ific ation R SI86 - 91 , AN SI/J- S T D-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
T
P
Ramp-up
T
L
Tsmax
Tsmin
Temperature
ts
Preheat
25
°
t 25 C to Pe a k
Classificatin Reflow Profiles
tp
Ramp-down
Time
Critical Zone
T
to T
L
P
t
L
Profile Feature
Average ramp-up rate (T
to TP)
L
Preheat
- Temperature Min (Tsmin)
- Temperature Mix (Tsmax)
- Time (min to max)(ts)
Tsmax to T
L
Sn-Pb Eutectic Assembly Pb-Free Assembly
Large Body Small Body Large Body Small Body
3°C/second max. 3°C/second max.
100°C 150°C
60-120 seconds
- Ramp-up Rate Tsmax to TL
- Temperature(T
- Time (t
)
L
Peak Temperature(Tp) Time within 5°C of actual Peak
Temperature(tp) Ramp-down Rate
Time 25°C to Peak Temperature
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2004
)
L
60-150 seconds
225 +0/-5°C 240 +0/-5°C 245 +0/-5°C 250 +0/-5°C
10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds
6°C/second max. 6°C/second max.
6 minutes max. 8 minutes max.
183°C
150°C 200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
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APL5523
R e lia bilit y te s t pr o g r am
SOLDERA BILITY MIL-STD-883D-2003 HO LT MIL-STD-883D-1005.7 PCT JESD-22-B, A102 TST MIL-STD-883D-1011.9 ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V La tc h -Up J E S D 7 8 10 ms , Itr > 100mA
Carrier Tape
Test item Method Description
245°C , 5 SEC 1000 Hrs Bias @ 125 °C 168 Hrs, 100 % RH , 121°C
-65°C ~ 150°C, 200 Cycles
t
E
F
W
Po
P
P1
Ao
D
Bo
Ko
D1
T2
A
Application
A B C J T1 T2 W P E
330±1 62 ± 1.5
SOP-8/P
F D D1 Po P1 Ao Bo Ko t
5.5 ± 0.1 1.55±0.1
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2004
J
12.75 +
0.1 5
1.55+ 0.25
C
B
T1
2 + 0.5 12.4 +0.2
2± 0.2
12 + 0.3
8± 0.1 1.75± 0.1
- 0.1
4.0 ± 0.1 2.0 ± 0.1 6.4 ± 0.1 5.2± 0.1 2.1± 0.1 0.3±0.013
(mm)
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APL5523
Cover Tape Dimensions
Application Carrier Width Cover Tape Width Devices Per Reel
SOP- 8/P
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, T aiwan, R.O.C. T el : 886-3-5642000 Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, T aipei Hsien, Taiwan, R. O. C. T el : 886-2-89191368 Fax : 886-2-89191369
12 9.3 2500
Copyright ANPEC Electronics Corp. Rev. A.1 - July., 2004
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