Datasheet APT33GF120LRD, APT33GF120B2RD Datasheet (Advanced Power Technology APT)

Page 1
APT33GF120B2RD
APT33GF120LRD
1200V 52A
APT33GF120B2RD
Fast IGBT & FRED
The Fast IGBT™ is a new generation of high voltage power IGBTs. Using Non-
T-Max
(B2RD)
TO-264
(LRD)
Punch Through Technology the Fast IGBT™ combined with an APT free­wheeling ultraFast Recovery Epitaxial Diode (FRED) offers superior
ruggedness and fast switching speed.
• Low Forward Voltage Drop • High Freq. Switching to 20KHz
G
C
E
G
C
APT33GF120LRD
E
C
• Low Tail Current • Ultra Low Leakage Current
• RBSOA and SCSOA Rated
• Ultrafast Soft Recovery Antiparallel Diode
MAXIMUM RATINGS (IGBT) All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
CES
V
CGR
V
I
C1
I
C2
I
CM1
I
CM2
P
TJ,T
T
Parameter
Collector-Emitter Voltage Collector-Gate Voltage (R Gate-Emitter Voltage
GE
Continuous Collector Current @ TC = 25°C Continuous Collector Current @ T Pulsed Collector Current Pulsed Collector Current Total Power Dissipation
D
Operating and Storage Junction Temperature Range
STG
Max. Lead Temp. for Soldering: 0.063" from Case for 10 Sec.
L
= 20K)
GE
= 90°C
C
1
@ TC = 25°C
1
@ TC = 90°C
G
E
APT33GF120B2RD/LRD
1200 1200
±20
52 33
104
66
300
-55 to 150 300
UNIT
Volts
Amps
Watts
°C
STATIC ELECTRICAL CHARACTERISTICS (IGBT)
Symbol
BV
VGE(TH)
V
CE
I
CES
I
GES
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33)5 57 92 15 15 FAX: (33) 5 56 47 97 61
Characteristic / Test Conditions
Collector-Emitter Breakdown Voltage (V
CES
Gate Threshold Voltage (V Collector-Emitter On Voltage (VGE = 15V, IC = 25A, Tj = 25°C)
(ON)
Collector-Emitter On Voltage (VGE = 15V, IC = 25A, Tj = 125°C) Collector Cut-off Current (V Collector Cut-off Current (VCE = V Gate-Emitter Leakage Current (VGE = ±20V, V
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
PRELIMINARY
= VGE, IC = 700µA, Tj = 25°C)
CE
= V
CE
CES
CES
APT Website - http://www.advancedpower.com
= 0V, IC = 0.5mA)
GE
, VGE = 0V, Tj = 25°C) , VGE = 0V, Tj = 125°C)
= 0V)
CE
2
2
MIN TYP MAX
1200
4.5 5.5 6.5
2.7 3.2
3.3 3.9
0.5
5.0
±100
UNIT
Volts
mA
nA
052-6254 Rev A
Page 2
DYNAMIC CHARACTERISTICS (IGBT) APT33GF120B2RD/LRD
Symbol
C
ies
C
oes
C
res
Q
g
Q
ge
Q
gc
td(on)
t
r
td(off)
t
f
td(on)
t
r
td(off)
t
f
E
on
E
off
E
ts
td(on)
t
r
td(off)
t
f
E
ts
gfe
Characteristic
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge
3
Gate-Emitter Charge Gate-Collector ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy
4
Turn-off Switching Energy Total Switching Losses
4
Turn-on Delay Time Rise Time
PRELIMINARY
Turn-off Delay Time Fall Time Total Switching Losses
4
Forward Transconductance
Test Conditions
Capacitance
= 0V
V
GE
V
= 25V
CE
f = 1 MHz
Gate Charge
V
= 15V
GE
V
= 0.5V
CC
CES
I
= I
C
C2
Resistive Switching (25°C)
= 15V
V
GE
V
= 0.8V
CC
CES
I
= I
C
C2
RG =10
Inductive Switching (150°C)
V
(Peak) = 0.66V
CLAMP
V
= 15V
GE
I
= I
C
C2
R
= 10
G
T
= +150°C
J
Inductive Switching (25
V
(Peak) = 0.66V
CLAMP
V
= 15V
GE
I
= I
C
C2
R
= 10
G
T
= +25°C
J
V
= 20V, I
CE
= 25A
C
CES
°C)
CES
MIN TYP MAX
1650 2200
230 325 110 160
165 250
20 30
100 150
30 140 155 200
28
60 280
30
3.0
3.0
6.0 28 70
250
25
5.0
8.5 20
UNIT
pF
nC
ns
ns
mJ
ns
mJ
S
THERMAL AND MECHANICAL CHARACTERISTICS (IGBT and FRED)
Symbol
R
ΘJC
R
ΘJA
W
Torque
1
Repetitive Rating: Pulse width limited by maximum junction temperature.
2
Leakages include the FRED and IGBT.
3
See MIL-STD-750 Method 3471
4
Switching losses include the FRED and IGBT.
052-6254 Rev A
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case (IGBT) Junction to Case (FRED) Junction to Ambient
Package Weight
T
Mounting Torque using a 6-32 or 3mm Binding Head Machine Screw
MIN TYP MAX
0.42
0.90 40
0.22
6.1 10
1.1
UNIT
°C/W
oz
gm lb•in N•m
Page 3
APT33GF120B2RD/LRD
PRELIMINARY
Power dissipation
P
parameter:
P
tot
T
tot
= ƒ(
)
C
T
150 °C
j
320
W
240
200
160
120
80
40
0
0 20 40 60 80 100 120 °C 160
Collector current
I
T
= ƒ(
C
parameter:
I
C
T
C
)
C
V
15 V ,
GE
55
A
45
40
35
30
25
20
15
10
5 0
0 20 40 60 80 100 120 °C 160
T
j
150 °C
T
C
Safe operating area
I
V
= ƒ(
C
parameter:
I
C
10
10
10
10
10
A
)
CE
D
, T
= 0
C
3
2
1
0
-1
10
0
10
1
= 25°C ,
10
Transient thermal impedance IGBT
Z
th JC
T
150 °C
j
t
= 2.0µs
p
10 µs
100 µs
1 ms
10 ms
DC
2
10
3
V
V
CE
parameter:
Z
thJC
= ƒ(
10
K/W
10
10
10
0
-1
-2
-3
10
t
p
-5
)
D = t
T
/
p
single pulse
-4
10
10
D = 0.50
0.20
0.10
0.05
0.02
0.01
-3
10
-2
10
-1
10 0 s
t
p
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33)5 57 92 15 15 FAX: (33) 5 56 47 97 61
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
052-6254 Rev A
Page 4
APT33GF120B2RD/LRD
PRELIMINARY
Typ. output characteristics
=
I
C
parameter:
I
C
)
f (V
CE
= 80 µs,
t
p
55
A
17V
45
40
35
30
25
20
15
10
15V 13V 11V 9V 7V
5 0
1.0 1.5 2.0 2.5 3.0 3.5
0 2 4 6 V 10
= 25 °C
T
j
Typ. output characteristics
IC = f (V
parameter:
I
C
V
CE
)
CE
= 80 µs,
t
p
55
A
17V
45
40
35
30
25
20
15
10
15V 13V 11V 9V 7V
5 0
2.0 2.5 3.0 3.5 4.0 4.5
0 2 4 6 V 10
= 125 °C
T
j
V
CE
Typ. transfer characteristics
= f (
I
C
parameter:
I
C
)
V
GE
=80µs,
t
p
60
A 50 45 40 35 30 25 20 15 10
5 0
0 2 4 6 8 10 V 14
V
CE
=20 V
V
GE
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33) 5 57 92 15 15 FAX: (33) 5 56 47 97 61
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
052-6254 Rev A
Page 5
Typ. gate charge
V
GE
parameter:
= ƒ(
20
Q
Gate
I
C puls
)
26A
= 25 A
Typ. capacitances
C = f (V
parameter:
10
CE
1
)
V
= 0 V, f = 1 MHz
GE
V
16
V
GE
14
12
10
8
6
4
2 0
0 20 40 60 80 100 120 140 170
Short circuit safe operating area
I
f (V
=
Csc
parameter:
10
CE
V
T
) ,
= 150°C
j
= ± 15 V,
GE
t
≤ 10 µs, L < 25 nH
sc
nF
C
800 V600 V
Q
Gate
0
10
-1
10
-2
10
0 5 10 15 20 25 30 V 40
V
C
Ciss
ies
Coss
C
oes
C
Crss
res
CE
Reverse biased safe operating area
I
= f (VCE) ,
Cpuls
parameter:
2.5
V
GE
T
= 150°C
j
= 15 V
I
Csc
I
/
C(90°C)
6
4
2
0
0 200 400 600 800 1000 1200 V 1600
I
Cpuls
V
CE
I
/
C
1.5
1.0
0.5
0.0 0 200 400 600 800 1000 1200 V 1600
V
CE
Page 6
APT33GF120B2RD/LRD
ULTRAFAST SOFT RECOVERY PARALLEL DIODE
MAXIMUM RATINGS (FRED) All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
V
RRM
V
RWM
IF(AV)
(RMS)
I
F
I
FSM
Characteristic / Test Conditions
Maximum D.C. Reverse Voltage
R
Maximum Peak Repetitive Reverse Voltage Maximum Working Peak Reverse Voltage Maximum Average Forward Current (T RMS Forward Current Non-Repetitive Forward Surge Current (TJ = 45°C, 8.3ms)
= 85°C, Duty Cycle = 0.5)
C
STATIC ELECTRICAL CHARACTERISTICS (FRED)
Symbol
V
Characteristic / Test Conditions
Maximum Forward Voltage I
F
I
F
F
IF = 30A, TJ = 150°C
= 30A = 60A
APT33GF120B2RD/LRD
1200
30 70
210
MIN TYP MAX
2.5
2.0
2.0
UNIT
Volts
Amps
UNIT
Volts
DYNAMIC CHARACTERISTICS (FRED)
Symbol
t
rr1
t
rr2
t
rr3
t
fr1
t
fr2
I
RRM1
I
RRM2
Q
rr1
Q
rr2
V
fr1
V
fr2
diM/dt
Characteristic
Reverse Recovery Time, I Reverse Recovery Time TJ = 25°C
= 30A, diF/dt = -240A/µs, VR = 650V TJ = 100°C
I
F
Forward Recovery Time TJ = 25°C
= 30A, diF/dt = 240A/µs, VR = 650V TJ = 100°C
I
F
Reverse Recovery Current T I
= 30A, diF/dt = -240A/µs, VR = 650V TJ = 100°C
F
Recovery Charge T I
= 30A, diF/dt = -240A/µs, VR = 650V TJ = 100°C
F
Forward Recovery Voltage T
= 30A, diF/dt = 240A/µs, VR = 650V TJ = 100°C
I
F
Rate of Fall of Recovery Current T I
= 30A, diF/dt = -240A /µs, VR = 650V (See Figure 10) TJ = 100°C
F
PRELIMINARY
= 1.0A, diF/dt = -15A/µs, VR = 30V, TJ = 25°C
F
= 25°C
J
= 25°C
J
= 25°C
J
= 25°C
J
MIN TYP MAX
70 85
70 160 255 255
712
12 20 660
1640
15
20 245 160
UNIT
ns
Amps
nC
Volts
A/µs
052-6254 Rev A
Page 7
100
80
60
40
, FORWARD CURRENT
F
20
TJ = 150°C
TJ = 100°C
TJ = 25°C
TJ = -55°C
APT33GF120B2RD/LRD
2400
2000
1600
1200
, REVERSE RECOVERY CHARGE
rr
800
400
TJ=100°C VR=650V
60A
30A
15A
0
0 1 2 3 4 10 50 100 500 1000
VF, ANODE-TO-CATHODE VOLTAGE (VOLTS) diF/dt, CURRENT SLEW RATE (AMPERES/µSEC)
0
Figure 1, Forward Voltage Drop vs Forward Current Figure 2, Reverse Recovery Charge vs Current Slew Rate
2.0
1.6
1.2
I
0.8
, DYNAMIC PARAMETERS Q
f
0.4
RRM
t
rr
Q
rr
t
rr
Q
rr
0.0
, REVERSE RECOVERY CURRENT I
RRM
50
TJ=100°C VR=650V
40
30
30A
20
60A
15A
10
0
0 200 400 600 800 1000 -50 -25 0 25 50 75 100 125 150
di
/dt, CURRENT SLEW RATE (AMPERES/µSEC) TJ, JUNCTION TEMPERATURE (°C)
F
Figure 3, Reverse Recovery Current vs Current Slew Rate Figure 4, Dynamic Parameters vs Junction Temperature
250
200
150
60A
30A
15A
TJ=100°C VR=650V
2000
1600
1200
TJ=100°C VR=650V
IF=30A
V
fr
100
80
60
, REVERSE RECOVERY TIME I
rr
Figure 5, Reverse Recovery Time vs Current Slew Rate Figure 6, Forward Recovery Voltage/Time vs Current Slew Rate
(°C/W) (nano-SECONDS) (AMPERES) (AMPERES)
, THERMAL IMPEDANCE t
ΘJC
Z
Figure 7, Maximum Effective Transient Thermal Impedance, Junction-To-Case vs Pulse Duration
052-6254 Rev A
100
PRELIMINARY
50
0
0 200 400 600 800 1000 0 200 400 600 800 1000
diF/dt, CURRENT SLEW RATE (AMPERES/µSEC) diF/dt, CURRENT SLEW RATE (AMPERES/µSEC)
800
(nano-SECONDS) (NORMALIZED) (nano-COULOMBS)
400
, FORWARD RECOVERY TIME K
fr
t
0
t
fr
1.0
0.5
D=0.5
0.2
0.1
0.05
0.01
0.005
0.001
-5
10
0.1
0.05
0.02
0.01 SINGLE PULSE
-4
10
-3
10
V
RECTANGULAR PULSE DURATION (SECONDS)
, REVERSE VOLTAGE (VOLTS)
R
-2
10
-1
10
NOTE:
DM
t
1
P
t
2
/
DUTY FACTOR D=t
=+
PEAK T P x Z T
DM JC
t
12
1.0 10
40
(VOLTS)
20
, FORWARD RECOVERY VOLTAGE
fr
V
0
CJ
Page 8
30µH
APT33GF120B2RD/LRD
V
r
D.U.T.
t
Q
/
rr
rr
Waveform
+15v
diF/dt Adjust
0v
-15v
Figure 25, Diode Reverse Recovery Test Circuit and Waveforms
1
- Forward Conduction Current
I
F
di
2
/dt - Current Slew Rate, Rate of Forward
F
Current Change Through Zero Crossing.
1
Zero
3
4
5 6
- Peak Reverse Recovery Current.
I
RRM
trr - Reverse Recovery Time Measured from Point of I
Current Falling Through Zero to a Tangent Line
Extrapolated Through Zero Defined by 0.75 and 0.50 I
Qrr - Area Under the Curve Defined by I
PRELIMINARY
diM/dt - Maximum Rate of Current Change During the Trailing Portion of t
PRELIMINARY
Figure 8, Diode Reverse Recovery Waveform and Definitions
RRM
and trr.
F
6
{
diM/dt
RRM
.
TRANSFORMER
}
PEARSON 411
CURRENT
2
rr.
4
6
5
3
Q
rr
= 1/
0.75 I
2
(
0.5 I
RRM
t
rr
.
RRM
I
RRM
)
Collector
(Cathode)
052-6254 Rev A
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
20.80 (.819)
21.46 (.845)
0.40 (.016)
0.79 (.031)
19.81 (.780)
20.32 (.800)
2.21 (.087)
2.59 (.102)
4.50
(.177) Max.
1.01 (.040)
1.40 (.055)
5.45 (.215) BSC 2-Plcs.
15.49 (.610)
16.26 (.640)
5.38 (.212)
6.20 (.244)
2.87 (.113)
3.12 (.123)
1.65 (.065)
2.13 (.084)
Gate Collector
(Cathode) Emitter
(Anode)
Collector
(Cathode)
TO-264 Package OutlineT-MAX™ Package Outline
4.60 (.181)
5.21 (.205)
1.80 (.071)
2.01 (.079)
25.48 (1.003)
26.49 (1.043)
19.81 (.780)
21.39 (.842)
0.48 (.019)
0.84 (.033)
2.59 (.102)
3.00 (.118)
Dimensions in Millimeters and (Inches)Dimensions in Millimeters and (Inches)
5.79 (.228)
6.20 (.244)
2.29 (.090)
2.69 (.106)
0.76 (.030)
1.30 (.051)
2.79 (.110)
3.18 (.125)
5.45 (.215) BSC 2-Plcs.
19.51 (.768)
20.50 (.807)
3.10 (.122)
3.48 (.137)
2.29 (.090)
2.69 (.106)
Gate Collector
(Cathode) Emitter
(Anode)