ON Semiconductor 2N4921, 2N4922, 2N4923 Service Manual

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ON Semiconductor 2N4921, 2N4922, 2N4923 Service Manual

2N4921, 2N4922, 2N4923

2N4923 is a Preferred Device

Medium−Power Plastic

NPN Silicon Transistors

These high−performance plastic devices are designed for driver circuits, switching, and amplifier applications.

Features

Low Saturation Voltage − VCE(sat) = 0.6 Vdc (Max) @ IC = 1.0 A

Excellent Power Dissipation Due to Thermopad Construction − PD = 30 W @ TC = 25_C

Excellent Safe Operating Area

Gain Specified to IC = 1.0 A

Complement to PNP 2N4918, 2N4919, 2N4920

Pb−Free Packages are Available*

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1.0 AMPERE

GENERAL PURPOSE POWER TRANSISTORS 40−80 VOLTS, 30 WATTS

MAXIMUM RATINGS

 

Rating

 

Symbol

Value

Unit

 

 

 

 

 

Collector−Emitter Voltage

2N4921

VCEO

40

Vdc

 

 

2N4922

 

60

 

 

 

2N4923

 

80

 

 

 

 

 

 

Collector−Emitter Voltage

2N4921

VCB

40

Vdc

 

 

2N4922

 

60

 

 

 

2N4923

 

80

 

 

 

 

 

 

Emitter Base Voltage

 

VEB

5.0

Vdc

Collector Current

− Continuous (Note 1)

IC

1.0

Adc

 

 

 

 

3.0

 

 

 

 

 

 

 

Base Current

− Continuous

 

IB

1.0

Adc

Total Power Dissipation @ TC = 25_C

PD

30

W

Derate above 25_C

 

 

0.24

mW/_C

Operating and Storage Junction

 

TJ, Tstg

–65 to +150

_C

Temperature Range

 

 

 

 

 

 

 

 

THERMAL CHARACTERISTICS (Note 2)

 

 

Characteristic

Symbol

Max

Unit

 

 

 

 

Thermal Resistance, Junction−to−Case

qJC

4.16

_C/W

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.

1.The 1.0 A maximum IC value is based upon JEDEC current gain requirements. The 3.0 A maximum value is based upon actual current handling capability of the device (see Figures 5 and 6).

2.Recommend use of thermal compound for lowest thermal resistance.

*Indicates JEDEC Registered Data.

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

TO−225

CASE 77

STYLE 1

3 2 1

MARKING DIAGRAM

1

 

 

YWW

 

 

 

2

 

 

 

 

N492xG

 

Y

= Year

 

WW

= Work Week

 

2N492x

= Device Code

 

 

x = 1, 2, or 3

G

= Pb−Free Package

 

 

 

ORDERING INFORMATION

 

 

 

 

 

Device

 

Package

 

Shipping

 

 

 

 

 

2N4921

 

TO−225

 

500 Units / Box

 

 

 

 

 

2N4921G

 

TO−225

 

500 Units / Box

 

 

(Pb−Free)

 

 

 

 

 

 

 

2N4922

 

TO−225

 

500 Units / Box

 

 

 

 

 

2N4922G

 

TO−225

 

500 Units / Box

 

 

(Pb−Free)

 

 

 

 

 

 

 

2N4923

 

TO−225

 

500 Units / Box

 

 

 

 

 

2N4923G

 

TO−225

 

500 Units / Box

 

 

(Pb−Free)

 

 

 

 

 

 

 

 

 

 

 

 

Preferred devices are recommended choices for future use and best overall value.

Semiconductor Components Industries, LLC, 2006

1

Publication Order Number:

January, 2006 − Rev. 11

 

2N4921/D

2N4921, 2N4922, 2N4923

ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted)

Characteristic

 

Symbol

Min

Max

Unit

 

 

 

 

 

 

OFF CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

Collector−Emitter Sustaining Voltage (Note 3)

 

VCEO(sus)

 

 

Vdc

(IC = 0.1 Adc, IB = 0)

2N4921

 

40

 

 

2N4922

 

60

 

 

2N4923

 

80

 

 

 

 

 

 

 

Collector Cutoff Current

 

ICEO

 

 

mAdc

(VCE = 20 Vdc, IB = 0)

2N4921

 

0.5

 

(VCE = 30 Vdc, IB = 0)

2N4922

 

0.5

 

(VCE = 40 Vdc, IB = 0)

2N4923

 

0.5

 

Collector Cutoff Current

 

ICEX

 

 

mAdc

(VCE = Rated VCEO, VEB(off) = 1.5 Vdc)

 

 

0.1

 

(VCE = Rated VCEO, VEB(off) = 1.5 Vdc, TC = 125_C

 

 

0.5

 

Collector Cutoff Current

 

ICBO

 

 

mAdc

(VCB = Rated VCB, IE = 0)

 

 

0.1

 

Emitter Cutoff Current

 

IEBO

 

 

mAdc

(VEB = 5.0 Vdc, IC = 0)

 

 

1.0

 

ON CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

DC Current Gain (Note 3)

 

hFE

 

 

(IC = 50 mAdc, VCE = 1.0 Vdc)

 

 

40

 

(IC = 500 mAdc, VCE = 1.0 Vdc)

 

 

30

150

 

(IC = 1.0 Adc, VCE = 1.0 Vdc)

 

 

10

 

Collector−Emitter Saturation Voltage (Note 3)

 

VCE(sat)

 

 

Vdc

(IC = 1.0 Adc, IB = 0.1 Adc)

 

 

0.6

 

Base−Emitter Saturation Voltage (Note 3)

 

VBE(sat)

 

 

Vdc

(IC = 1.0 Adc, IB = 0.1 Adc)

 

 

1.3

 

Base−Emitter On Voltage (Note 3)

 

VBE(on)

 

 

Vdc

(IC = 1.0 Adc, VCE = 1.0 Vdc)

 

 

1.3

 

SMALL−SIGNAL CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

Current−Gain − Bandwidth Product

 

fT

 

 

MHz

(IC = 250 mAdc, VCE = 10 Vdc, f = 1.0 MHz)

 

 

3.0

 

Output Capacitance

 

Cob

 

 

pF

(VCB = 10 Vdc, IE = 0, f = 100 kHz)

 

 

100

 

Small−Signal Current Gain

 

hfe

 

 

(IC = 250 mAdc, VCE = 10 Vdc, f = 1.0 kHz)

 

 

25

 

3. Pulse Test: PW 300 ms, Duty Cycle 2.0%.

*Indicates JEDEC Registered Data.

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