Toshiba tecra m9 Service Manual

5 (2)

Toshiba Personal Computer

TECRA M9

Maintenance Manual

TOSHIBA CORPORATION

File Number 960-631

[CONFIDENTIAL]

Copyright

© 2007 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein.

Toshiba Personal Computer TECRA M9Maintenance Manual

First edition April 2007

Disclaimer

The information presented in this manual has been reviewed and validated for accuracy. The included set of instructions and descriptions are accurate for the TECRA M9 at the time of this manual's production. However, succeeding computers and manuals are subject to change without notice. Therefore, Toshiba assumes no liability for damages incurred directly or indirectly from errors, omissions, or discrepancies between any succeeding product and this manual.

Trademarks

IBM is a registered trademark and IBM PC is a trademark of International Business Machines Corporation.

Intel, Intel SpeedStep, Intel Core and Centrino are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries/regions. Windows and Microsoft are registered trademarks of Microsoft Corporation.

Photo CD is a trademark of Eastman Kodak.

Sonic RecordNow! is a registered trademark of Sonic Solutions.

Bluetooth is a trademark owned by its proprietor and used by TOSHIBA under license. i.LINK is trademark and registered trademark of Sony Corporation.

InterVideo and WinDVD are registered trademarks of InterVideo Inc. WinDVD Creator is trademark of InterVideo Inc.

Other trademarks and registered trademarks not listed above may be used in this manual.

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Preface

This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA M9.

The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.

SAFETY PRECAUTIONS

Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.

DANGER: “Danger” indicates the existence of a hazard that could result in death or serious bodily injury, if the safety instruction is not observed.

WARNING: “Warning” indicates the existence of a hazard that could result in bodily injury, if the safety instruction is not observed.

CAUTION: “Caution” indicates the existence of a hazard that could result in property damage, if the safety instruction is not observed.

NOTE: “Note” contains general information that relates to your safe maintenance service.

Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.

Be sure to fasten screws securely with the right screwdriver. If a screw is not fully fastened, it could come loose, creating a danger of a short circuit, which could cause overheating, smoke or fire.

If you replace the battery pack or RTC battery, be sure to use only the same model battery or an equivalent battery recommended by Toshiba. Installation of the wrong battery can cause the battery to explode.

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The manual is divided into the following parts:

Chapter 1 Hardware Overview describes the TECRA M9 system unit and each FRU.

Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems.

Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service.

Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.

Appendices The appendices describe the following:

Handling the LCD module

Board layout

Pin assignments

Keyboard scan/character codes

Key layout

Wiring diagrams

BIOS rewrite procedures

EC/KBC rewrite procedures

Reliability

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Conventions

This manual uses the following formats to describe, identify, and highlight terms and operating procedures.

Acronyms

On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example:

Read Only Memory (ROM)

Keys

Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.

Key operation

Some operations require you to simultaneously use two or more keys. We identify such operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause (Break) means you must hold down Ctrl and at the same time press Pause (Break). If three keys are used, hold down the first two and at the same time press the third.

User input

Text that you are instructed to type in is shown in the boldface type below:

DISKCOPY A: B:

The display

Text generated by the computer that appears on its display is presented in the type face below:

Format complete

System transferred

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Table of Contents

Chapter 1 Hardware Overview

 

1.1

Features ......................................................................................................................

1-1

1.2

System Unit Block Diagram ......................................................................................

1-8

1.3

3.5-inch Floppy Disk Drive (USB External) ...........................................................

1-14

1.4

2.5-inch Hard Disk Drive.........................................................................................

1-15

1.5

DVD-Super Multi Drive ..........................................................................................

1-16

1.6

Keyboard..................................................................................................................

1-17

1.7

TFT Color Display...................................................................................................

1-18

1.8

Power Supply ...........................................................................................................

1-21

1.9

Power Supply ...........................................................................................................

1-26

1.10

Batteries ...................................................................................................................

1-29

Chapter 2 Troubleshooting Procedures

 

2.1

Troubleshooting .........................................................................................................

2-1

2.2

Troubleshooting Flowchart........................................................................................

2-2

2.3

Power Supply Troubleshooting..................................................................................

2-6

2.4

System Board Troubleshooting................................................................................

2-16

2.5

USB FDD Troubleshooting .....................................................................................

2-31

2.6

HDD Troubleshooting .............................................................................................

2-34

2.7

Keyboard and Touch pad Troubleshooting..............................................................

2-39

2.8

Display Troubleshooting..........................................................................................

2-42

2.9

Optical Drive Troubleshooting ................................................................................

2-44

2.10

Modem Troubleshooting..........................................................................................

2-46

2.11

LAN Troubleshooting..............................................................................................

2-48

2.12

Bluetooth Troubleshooting ......................................................................................

2-49

2.13

Wireless LAN Troubleshooting...............................................................................

2-52

2.14

Sound Troubleshooting............................................................................................

2-55

2.15

SD Card Slot Troubleshooting.................................................................................

2-58

2.16

Fingerprint Sensor Troubleshooting ........................................................................

2-59

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Chapter 3 Tests and Diagnostics

 

3.1

The Diagnostic Test ...................................................................................................

3-1

3.2

Executing the Diagnostic Test ...................................................................................

3-4

3.3

Setting of the hardware configuration .......................................................................

3-9

3.4

Heatrun Test.............................................................................................................

3-11

3.5

Subtest Names..........................................................................................................

3-12

3.6

System Test..............................................................................................................

3-14

3.7

Memory Test............................................................................................................

3-16

3.8

Keyboard Test..........................................................................................................

3-17

3.9

Display Test .............................................................................................................

3-18

3.10

Floppy Disk Test......................................................................................................

3-21

3.11

Printer Test...............................................................................................................

3-23

3.12

Async Test ...............................................................................................................

3-25

3.13

Hard Disk Test .........................................................................................................

3-26

3.14

Real Timer Test........................................................................................................

3-29

3.15

NDP Test..................................................................................................................

3-31

3.16

Expansion Test.........................................................................................................

3-32

3.17

CD-ROM/DVD-ROM Test .....................................................................................

3-34

3.18

Error Code and Error Status Names.........................................................................

3-35

3.19

Hard Disk Test Detail Status ...................................................................................

3-38

3.20

ONLY ONE TEST...................................................................................................

3-40

3.21

Head Cleaning..........................................................................................................

3-48

3.22

Log Utilities .............................................................................................................

3-49

3.23

Running Test............................................................................................................

3-51

3.24

Floppy Disk Drive Utilities......................................................................................

3-52

3.25

System Configuration ..............................................................................................

3-58

3.26

Wireless LAN Test Program (Intel-made b/g,a/b/g Setting up of REF PC)............

3-60

3.27

Wireless LAN Test Program on DUT PC(Intel-made)............................................

3-65

3.28

LAN/Modem/Bluetooth/IEEE1394 Test Program ..................................................

3-73

3.29

Sound Test program.................................................................................................

3-80

3.30

SETUP .....................................................................................................................

3-86

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Chapter 4 Replacement Procedures

 

4.1

Overview...................................................................................................................

4-1

4.2

Battery pack ..............................................................................................................

4-8

4.3

PC card/SD card......................................................................................................

4-10

4.4

Memory module B ..................................................................................................

4-12

4.5

HDD........................................................................................................................

4-14

4.6

Slim select bay module ...........................................................................................

4-18

4.7

Keyboard holder......................................................................................................

4-21

4.8

Switch board ...........................................................................................................

4-22

4.9

Bluetooth module....................................................................................................

4-23

4.10

Keyboard/Memory module A .................................................................................

4-24

4.11

Fan holder ...............................................................................................................

4-29

4.12

Wireless LAN card .................................................................................................

4-30

4.13

Touch pad................................................................................................................

4-33

4.14

Cover assembly and Base assembly .......................................................................

4-36

4.15

Fingerprint sensor board .........................................................................................

4-39

4.16

RTC battery.............................................................................................................

4-42

4.17

Microphone .............................................................................................................

4-43

4.18

System board...........................................................................................................

4-44

4.19

Base latch ................................................................................................................

4-47

4.20

HDD cable/DC-IN jack...........................................................................................

4-48

4.21

MDC .......................................................................................................................

4-49

4.22

North bridge heat sink/CPU heat sink/Fan/CPU ....................................................

4-50

4.23

LCD unit/FL inverter ..............................................................................................

4-55

4.24

LCD cable ...............................................................................................................

4-60

4.25

Wireless LAN antenna/Bluetooth antenna..............................................................

4-61

4.26

Hinge.......................................................................................................................

4-62

4.27

Speaker....................................................................................................................

4-65

4.28

Fluorescent Lamp....................................................................................................

4-68

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Appendices

 

 

Appendix A

Handling the LCD Module ...........................................................................

A-1

Appendix B

Board Layout ................................................................................................

B-1

Appendix C

Pin Assignments............................................................................................

C-1

Appendix D

Keyboard Scan/Character Codes ..................................................................

D-1

Appendix E

Key Layout.....................................................................................................

E-1

Appendix F

Wiring Diagrams............................................................................................

F-1

Appendix G

BIOS rewrite Procedures ..............................................................................

G-1

Appendix H

EC/KBC rewrite Procedures .........................................................................

H-1

Appendix I

Reliability........................................................................................................

I-1

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Chapter 1

Hardware Overview

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1 Hardware Overview

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1 Hardware Overview

 

 

 

Chapter 1

Contents

 

1.1

Features.......................................................................................................................

 

1-1

1.2

System Unit Block Diagram.......................................................................................

1-8

1.3

3.5-inch Floppy Disk Drive (USB External)............................................................

1-14

1.4

2.5-inch Hard Disk Drive .........................................................................................

1-15

1.5

DVD-Super Multi Drive...........................................................................................

1-16

1.6

Keyboard .................................................................................................................

 

1- 17

1.7

TFT Color Display ..................................................................................................

1- 18

 

1.7.1

LCD Module ......................................................................................

1- 18

 

1.7.2

FL Inverter Board ..............................................................................

1- 20

1.8

Power Supply...........................................................................................................

1- 21

1.9

Batteries...................................................................................................................

 

1- 26

 

1.12.1

Main Battery ......................................................................................

1- 26

 

1.12.2

Battery Charging Control...................................................................

1- 27

 

1.12.3

RTC battery........................................................................................

1- 28

1.10

AC Adaptor .............................................................................................................

 

1- 29

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1 Hardware Overview

Figures

 

 

Figure 1-1

Front of the computer ....................................................................................

1- 6

Figure 1-2

System unit configuration..............................................................................

1- 7

Figure 1-3

System unit block diagram ............................................................................

1- 8

Figure 1-4

3.5-inch FDD (USB External).....................................................................

1- 14

Figure 1-5

2.5-inch HDD ..............................................................................................

1- 15

Figure 1-6

Keyboard .....................................................................................................

1- 17

Figure 1-7

LCD module ................................................................................................

1- 18

Tables

 

 

Table 1-1

3.5-inch FDD specifications........................................................................

1- 14

Table 1-2

2.5-inch HDD specifications .......................................................................

1- 15

Table 1-3

DVD Super Multi drive specifications ........................................................

1- 16

Table 1-4

LCD module specifications .........................................................................

1- 18

Table 1-5

FL inverter board specifications..................................................................

1- 20

Table 1-6

Power supply output rating..........................................................................

1- 22

Table 1-7

Battery specifications ..................................................................................

1- 26

Table 1-8

Time required for charges ...........................................................................

1- 27

Table 1-9

RTC battery charging/data preservation time..............................................

1- 28

Table 1-10

AC adapter specifications............................................................................

1- 29

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1.1 Features

1 Hardware Overview

1.1Features

The Toshiba TECRA M9 Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features.

There some models and options. Refer to the Parts List for the configuration of each model and options.

Microprocessor

The TECRA M9 computer is equipped with an Intel® CoreTM 2 Duo Processor . These processors incorporate a math co-processor, a 2MB or 4MB L2 cache memory.

The PC comes in with one of the following speeds: Intel® CoreTM 2 Duo Processor

2.40GHz (T7700) /2.20GHz (T7500) / 2.00GHz (T7300)

In the case of Processor which built in 4MB L2 cache memory

1.80GHz (T7100)

In the case of Processor which built in 2MB L2 cache memory

These processors operate at 800MHz bus clock.

Chipset

The TECRA M9 is Equipped with Intel Crestline-GM as North Bridge, Intel ICH8M as South Bridge and PCI7412 as Card Controller.

VGA Controller

An internal Graphics Controller in North Bridge is used.

Memory

The computer comes with two DDR2 SO-DIMM slots. Two memory modules of , 512MB, 1GB (1,024MB) or 2GB (2,048MB) can be installed.

HDD

The computer has a 2.5-inch SATA HDD. The following capacities are available.

/80/100/120/160 GB

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1.1 Features

USB FDD

A 3.5-inch USB FDD accommodates 2HD (1.44MB) or 2DD (720KB) disks.

Slim Bay

An Optical drive, 2nd HDD can be installed in the Slim Bay.

Optical Drive

A CD-ROM drive, DVD Super Multi drive can be installed in the Slim Bay.

Display

The PC comes in with one of the following two types:

14.1” WXGA-TFT color display, resolution 1,280×800

14.1” WXGA+TFT color display, resolution 1,440×900

A video controller and a 128MB VRAM enables an external monitor to display 16M colors at a resolution of 1,280×800 pixels or 1,440×900 pixels.

Keyboard

An-easy-to-use 85(US)/87(UK)-key keyboard provides a numeric keypad overlay for fast

numeric data entry or for cursor and page control. The keyboard also includes two keys that have special functions in Microsoft® Windows® Vista. It supports software that uses a 101or 102-key enhanced keyboard.

TOSHIBA Dual Pointing Device

The TOSHIBA Dual Pointing Device consists of Touch Pad and AccuPoint. The touch pad and control buttons enable control of the on-screen pointer and scrolling of windows. The pointer control stick and AccuPoint enables convenient control of the cursor.

Batteries

The computer has two batteries: a rechargeable Lithium-Ion main battery pack and RTC battery (that backs up the Real Time Clock and CMOS memory).

1-2

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1.1 Features

1 Hardware Overview

Universal Serial Bus (USB2.0)

Three USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported.

IEEE 1394 port

The computer comes with one IEEE 1394 port. It enables high-speed data transfer directly from external devices such as digital video cameras.

Serial port

The serial port enables connection of serial devices such as an external modem, serial mouse or serial printer.

External monitor (RGB) port

The port enables connection of an external monitor, which is recognized automatically by Video Electronics Standards Association (VESA) Display Data Channel (DDC) 2B compatible functions.

PC card slot

A PC card slot are provided. The PC card slot (PCMCIA) accommodates one Type II card and .

SD Card slot

The SD Card Slot can accommodate Secure Digital flash memory cards with various capacities. SD cards let you easily transfer data from devices, such as digital cameras and Personal Digital Assistants, which use SD Card flash-memory.

Fingerprint sensor

The computer is equipped with a fingerprint sensor and fingerprint authentication utility. They enable only person who has registered his/her fingerprint to use the computer.

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1 Hardware Overview

1.1 Features

Docking interface port

The docking interface port enables connection of an optional Express Port Replicator. It provides additional features as follows:

RJ45 LAN jack

External monitor port

DC IN 15V jack

Security lock slot

Universal Serial Bus 2.0 port (four)

DVI port

Sound system

The sound system is equipped with the following features:

Stereo speakers

Built-in microphone

Digital volume control

Stereo headphone jack

External microphone jack

Supports VoIP

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1.1 Features

1 Hardware Overview

Internal modem

The computer contains a MDC, enabling data and fax communication. It supports ITU-T V.90 (V.92). The transfer rates are 56 Kbps for data reception, 33.6 Kbps for data transmission, and 14,400 bps for fax transmission. However, the actual speed depends on the line quality. The RJ11 modem jack is used to accommodate a telephone line. Both of V.90 and V.92 are supported only in USA, Canada and Australia. Only V.90 is available in other regions.

Internal LAN

The computer is equipped with LAN circuits that support Gigabit Ethernet LAN (1000 megabits per second, 1000BASE-T). It also supports Wakeup on LAN (WOL), Magic Packet and LED.

θ Wireless LAN

The computer is equipped with PCI-Ex MiniCard type wireless LAN board that supports 802.11 a/b/g or 802.11 a/b/g/n in the PCI-Ex MiniCard slot. This function can be switched on and off by a switch on the computer.

Bluetooth

The computer is equipped with Bluetooth (V2.0+EDR) communications standard enable wireless connection between electronic devices such as computers and printers. It supports wireless communication switch.

Presentation button

This button switches the display between internal display, external display, simultaneous display and multi-monitor display.

TOSHIBA Assist button

When this button is pressed during power-on, the PC is connected to "Toshiba Assist". When this button is pressed during power-off, the PC is turned on and connected to "Toshiba Assist".

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1 Hardware Overview

1.1 Features

The front of the computer is shown in figure 1-1.

 

Figure 1-1 Front of the computer

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1.1 Features

1 Hardware Overview

The system unit configuration is shown in figure 1-2.

 

Figure 1-2 System unit configuration

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1 Hardware Overview

1.2 System Unit Block Diagram

1.2System Unit Block Diagram

Figure 1-3 is a block diagram of the system unit.

Figure 1-3 System unit block diagram

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1.2 System Unit Block Diagram

1 Hardware Overview

The system unit is composed of the following major components:

Processor

Intel® CoreTM 2 Duo Processor

Core speed:

2.40GHz (T7700) /2.20GHz (T7500) / 2.00GHz (T7300)

In the case of Processor which built in 4MB L2 cache memory

1.80GHz (T7100)

In the case of Processor which built in 2MB L2 cache memory

( ): Processor Number

Processor bus speed: 800MHz

Core voltage: 0.50V to 1.325V

Integrated L2 cache memory of 2MB or 4MB

Integrated NDP

478-pin Micro FC-PGA package

Memory

Two memory slots are provided. Expansion up to 4GB (4,096MB) is available.

Memory

DDR2-SDRAM

667MHz

1.8 volt operation

FBGA

Memory Module

200 pin, SO Dual In-line Memory Module (SO-DIMM)

PC 5300

512MB/1GB (1,024MB)/2GB (2,048MB)

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1 Hardware Overview

1.2 System Unit Block Diagram

Intel Crestline-GM (North Bridge)

Features:

Meorom Processor System Bus Supports

PCI Express Based Graphics Interface

System Memory supports :DDR2-533 DDR2-667, 4GB max.

DMI(Direct Media Interface)

Power management control (ACPI2.0 conformity)

Intel ICH8M (South Bridge)

Features:

DMI(Direct Media Interface)

PCI Express Interface

PCI Bus I/F Rev2.3 4 PCI REQ/GNT Pairs

Integrated Serial ATA Host Controller

Integrated IDE Controller Ultra ATA 100/66/33

Intel High Definition controller (Azalia)

USB 1.1/2.0 Controller

Power Management (ACPI 2.0 compliance)

SMBus2.0 controller

SPI Interface(BIOS)

LPC interface (EC/KBC, Super I/O)

IRQ controller

Serial Interrupt Function

Suspend/Resume control

Built –in RTC

GPIO

1-10

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1.2 System Unit Block Diagram

1 Hardware Overview

Cardbus controller (TI PCI8412ZHK)

PCI Interface(PCI Rev.2.2)

SD IO Controller(Ver.1.1)

CardBus / Ultra media Controller (Yenta Ver.2.2:1 socket)

SD/MMC(SDHC Ver. 1.2 revised edition) , Memory Stick, Memory Stick pro, XD Card Controller

1394 Controller

16 x16x1.4mm BGA Package

VGA

Graphics interface in North Bridge (Intel Crestline-GM) is used.

Sound Controller

Azalia

Amplifier: Mathushita made AN12941A

Stereo speakers

Digital volume control

Supports VoIP

Stereo headphone jack

External microphone jack

Built-in microphone

EC/KBC (Embedded Controller/Keyboard Controller)

One Mitsubishi M306KAFCLPR micon chip functions as both EC and KBC.

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1 Hardware Overview

1.2 System Unit Block Diagram

PSC (Power Supply Controller)

One TMP86FS49AUG chip is used.

This controller controls the power sources.

Clock Generator

IDT 9LPR501PGLFT is used.

This device generates the system clock.

Modem Controller

One MDC is used.

This controller has the following functions:

One RJ11 port

Azalia MDC1.5

V.92 (V.90) 56K Modem/FAX

Ring wake up support

Internal LAN Controller

Intel made only GigaBit Ether is used.

This controller has the following functions:

PCI-Ex connection

Supports Gigabit Ethernet

One RJ45 port

WOL support

Magic Packet support

LED support

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1.2 System Unit Block Diagram

1 Hardware Overview

Wireless LAN

One PCI-Ex MiniCard

Intel Kedron a/b/g or a/b/g/n

Supports Wireless Communication SW

Supports W-LAN via PCMCIA (Euro : GSM/GPRS)

Super I/O

SMSC LPC47N217-JV chip is used.

This gate array has the following features:

Serial Port Controller

GPIO Controller

Bluetooth

V2.0+EDR

USB interface connection

Sensor

Thermal Sensor: One ADM1032ARMZ chip is used.

LCD Sensor: One NRS-701-1015T chip is used.

Acceleration Sensor

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1.3 3.5-inch Floppy Disk Drive (USB External)

1.33.5-inch Floppy Disk Drive (USB External)

The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD and 1.44MB (formatted) 2HD disks.

The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1.

Figure 1-4 3.5-inch FDD (USB External)

Table 1-1 3.5-inch FDD specifications

 

 

TEAC FD-05PUB-337

Items

(G8AC0000B320)

 

 

720KB mode

 

1.44MB mode

 

 

 

 

 

Data transfer rate

FDD part

250K bits/second

 

500K bits/second

 

 

 

 

 

USB

Full speed mode (12M bits/second)

 

 

 

 

Disk rotation speed

 

300rpm

 

 

Track density

5.3 track/mm (135TPI)

 

 

 

 

 

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1.4 2.5-inch Hard Disk Drive

1 Hardware Overview

1.42.5-inch Hard Disk Drive

The removable HDD is a random access non-volatile storage device. It has a non-removable 2.5-inch magnetic disk and mini-Winchester type magnetic heads.

The computer supports a 80GB, 120GB or 160GB.

The HDD is shown in figure 1-5. Specifications are listed in Table 1-2.

Figure 1-5 2.5-inch HDD

Table 1-2 2.5-inch HDD specifications

 

 

 

 

Specifications

 

Items

 

 

 

FUJITSU

FUJITSU

FUJITSU

 

 

 

G8BC0003J080

G8BC0003H120

G8BC0003J160

 

 

 

 

 

 

Outline

 

Width (mm)

 

100.0

 

Dimensions

 

Height (mm)

 

9.5

 

 

 

Depth (mm)

 

70.0

 

 

 

Weight (g)

 

101 max

 

Storage size (formatted)

80GB

120GB

160GB

 

 

 

 

 

Speed (RPM)

 

 

5,400

 

 

 

 

 

Data transfer speed (Mb/s)

 

72.4 MB/s Max

 

To/Form Media

 

 

 

150 MB/s (Genli)

 

To/Form Host

 

 

 

 

 

 

 

 

 

 

 

Data buffer size (MB/s)

 

8

 

 

 

 

 

Positioning Time(read and

 

Read: 12ms

 

seek time)

 

 

 

 

 

 

 

 

 

 

 

Motor startup time (s)

 

4

 

 

 

 

 

 

 

TECRA M9 Maintenance Manual (960-631)

[CONFIDENTIAL]

1-15

1 Hardware Overview

1.5 DVD-Super Multi Drive

1.5DVD-Super Multi Drive

This drive is a combination of DVD-ROM and DVD±R/±RW/-RAM Drive. It is full-size and runs either 12cm (4.72-inch) or 8cm (3.15-inch) DVD/CDs without an adaptor. It reads DVDs at maximum 8-speed and CDs at maximum 24-speed. It also writes CD-R at maximum 24-speed, CD-RW at maximum 16-speed, DVD-R at maximum 8-speed, DVDRW at maximum 6-speed, DVD+R at maximum 8-speed, DVD +RW at maximum 8-speed and DVD-RAM at maximu5 speed.

The DVD Super Mult drive is Specifications are listed in Table 1-3.

Table 1-3 DVD Super Multi drive specifications

Item

Panasonic UJ-852

(G8CC00034120)

 

 

 

IDE Data Transfer Mode

33.3 (Ultra DMA mode 2)

 

16.6 (PIO Mode 4, Multi word DMA mode 2)

 

 

Data buffer (MB)

2

 

 

Supported format

CDs

 

DVD-ROM

 

CD-R (Read/ Write)

 

Mutti –Speed CD-RW discs (Read/ Write)

 

High-Speed CD-RW discs (Read/ Write)

 

Ultra-Speed CD-RW discs (Read/ Write)

 

DVD-R Ver.2.00 for General(Read/ Write)

 

DVD-R DL (Read/Write)

 

DVD+R (Read/Write)

 

DVD+R DL (Read / Write)

 

DVD-RW Ver.1.0 &1.1 &1.2(Read/ Write)

 

DVD+RW (Read/Write)

 

DVD-RAM Ver.2.0 &2.1 &2.2(Read/ Write)

1-16

[CONFIDENTIAL]

TECRA M9 Maintenance Manual (960-631)

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