Siemens IPC427C User Manual

SIMATIC

Industrial PC

SIMATIC IPC427C

Operating Instructions

04/2009

	Introduction	1
	Safety Instructions	2
	Description	3
	Application planning	4
	Installing/mounting	5
	Connecting	6
	Commissioning	7
	Integration into an
		8
	Automation System
	Functions	9
	Expansions and
		10
	Configurations
	Maintenance and Service	11
	Alarm, error and system
		12
	messages
	Troubleshooting/FAQs	13
	_Technical specifications	14
	Dimension drawings	15
	Detailed descriptions	16
	Appendix	A
	ESD guidelines	B
	List of abbreviations	C

A5E02414743-01

Legal information

Warning notice system

This manual contains notices you have to observe in order to ensure your personal safety, as well as to prevent damage to property. The notices referring to your personal safety are highlighted in the manual by a safety alert symbol, notices referring only to property damage have no safety alert symbol. These notices shown below are graded according to the degree of danger.

DANGER

indicates that death or severe personal injury will result if proper precautions are not taken.

WARNING

indicates that death or severe personal injury may result if proper precautions are not taken.

CAUTION

with a safety alert symbol, indicates that minor personal injury can result if proper precautions are not taken.

CAUTION

without a safety alert symbol, indicates that property damage can result if proper precautions are not taken.

NOTICE

indicates that an unintended result or situation can occur if the corresponding information is not taken into account.

If more than one degree of danger is present, the warning notice representing the highest degree of danger will be used. A notice warning of injury to persons with a safety alert symbol may also include a warning relating to property damage.

Qualified Personnel

The device/system may only be set up and used in conjunction with this documentation. Commissioning and operation of a device/system may only be performed by qualified personnel. Within the context of the safety notes in this documentation qualified persons are defined as persons who are authorized to commission, ground and label devices, systems and circuits in accordance with established safety practices and standards.

Proper use of Siemens products

Note the following:

WARNING

Siemens products may only be used for the applications described in the catalog and in the relevant technical documentation. If products and components from other manufacturers are used, these must be recommended or approved by Siemens. Proper transport, storage, installation, assembly, commissioning, operation and maintenance are required to ensure that the products operate safely and without any problems. The permissible ambient conditions must be adhered to. The information in the relevant documentation must be observed.

Trademarks

All names identified by ® are registered trademarks of the Siemens AG. The remaining trademarks in this publication may be trademarks whose use by third parties for their own purposes could violate the rights of the owner.

Disclaimer of Liability

We have reviewed the contents of this publication to ensure consistency with the hardware and software described. Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the information in this publication is reviewed regularly and any necessary corrections are included in subsequent editions.

Siemens AG	A5E02414743-01	Copyright © Siemens AG 2009.
Industry Sector	04/2009	Technical data subject to change

Postfach 48 48 90026 NÜRNBERG GERMANY

Table of contents

1	Introduction................................................................................................................................................		7
	1.1	Preface...........................................................................................................................................	7
	1.2	Guideline to the Operating Instructions .........................................................................................	8
2	Safety Instructions.....................................................................................................................................		9
	2.1	General safety instructions ............................................................................................................	9
3	Description...............................................................................................................................................		11
	3.1	Overview......................................................................................................................................	11
	3.2	Applications..................................................................................................................................	12
	3.3	Features.......................................................................................................................................	13
	3.4	Windows Embedded Standard 2009...........................................................................................	15
	3.5	Design..........................................................................................................................................	17
	3.5.1	External Design............................................................................................................................	17
	3.5.2	Connection components..............................................................................................................	18
	3.5.3	Operator controls.........................................................................................................................	19
	3.5.4	Status displays.............................................................................................................................	20
4	Application planning.................................................................................................................................		21
	4.1	Transport......................................................................................................................................	21
	4.2	Unpacking and checking the delivery unit ...................................................................................	22
	4.3	Ambient and Environmental Conditions.......................................................................................	24
5	Installing/mounting...................................................................................................................................		25
	5.1	Permitted mounting positions.......................................................................................................	25
	5.2	Mounting information ...................................................................................................................	27
	5.3	Mounting the device.....................................................................................................................	27
	5.4	Mounting on DIN rails ..................................................................................................................	28
	5.5	Mounting with mounting brackets................................................................................................	30
	5.6	Upright mounting..........................................................................................................................	32
6	Connecting ..............................................................................................................................................		33
	6.1	Connecting peripheral equipment................................................................................................	33
	6.2	Connecting the 24 V DC power supply........................................................................................	34
	6.3	Protective ground connection ......................................................................................................	35
	6.4	USB strain-relief...........................................................................................................................	36

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Table of contents

7	Commissioning........................................................................................................................................		37
	7.1	Note before commissioning.........................................................................................................	37
	7.2	Commissioning - Windows Embedded Standard 2009 ..............................................................	38
	7.2.1	Basic commissioning - initial startup...........................................................................................	38
	7.3	Commissioning - Windows XP Professional...............................................................................	40
	7.3.1	Basic commissioning - initial startup...........................................................................................	40
	7.3.2	Setting up the language selection for Windows XP Professional / Embedded Standard...........	41
	7.4	Commissioning - other operating systems..................................................................................	42
	7.4.1	Commissioning - guide................................................................................................................	42
8	Integration into an Automation System....................................................................................................		43
	8.1	Overview.....................................................................................................................................	43
9	Functions.................................................................................................................................................		45
	9.1	Monitoring Functions...................................................................................................................	45
	9.1.1	Introduction .................................................................................................................................	45
	9.1.2	Temperature monitoring/display .................................................................................................	46
	9.1.3	Watchdog (WD)...........................................................................................................................	47
	9.2	Enhanced Write Filter (EWF)......................................................................................................	48
	9.3	File Based Write Filter (FBWF)...................................................................................................	50
	9.4	SRAM buffer memory..................................................................................................................	52
	9.5	Battery monitoring.......................................................................................................................	53
	9.6	Operation without monitor and keyboard....................................................................................	54
10	Expansions and Configurations...............................................................................................................		55
	10.1	Open the device (front panel) .....................................................................................................	55
	10.2	Memory expansion......................................................................................................................	57
	10.2.1	Installing the memory module.....................................................................................................	57
	10.3	Installing PCI-104 / PC/104 Plus modules..................................................................................	59
	10.3.1	Notes on the modules.................................................................................................................	59
	10.3.2	Mounting PCI-104 or PC/104 Plus modules...............................................................................	60
	10.4	Installing/Removing Compact Flash Cards.................................................................................	62
	10.4.1	Installation options for Compact Flash cards..............................................................................	62
	10.4.2	Installing/removing an accessible Compact Flash card..............................................................	63
	10.4.3	Installing/removing a built-in Compact Flash card......................................................................	66
11	Maintenance and Service ........................................................................................................................		67
	11.1	Removing and Installing Hardware Components........................................................................	67
	11.1.1	Repairs........................................................................................................................................	67
	11.1.2	Preventive maintenance..............................................................................................................	68
	11.1.3	Replacing hard disk or SSD drive...............................................................................................	69
	11.1.4	Replace the backup battery........................................................................................................	71
	11.2	Reinstalling the operating system...............................................................................................	73
	11.2.1	Windows Embedded Standard 2009 ..........................................................................................	73
	11.2.1.1	General installation procedure....................................................................................................	73
	11.2.1.2	Restoring the software to factory state using the Restore DVD .................................................	74
	11.2.2	Windows XP Professional...........................................................................................................	76
	11.2.2.1	General installation procedure....................................................................................................	76
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			Table of contents
	11.2.2.2	Restoring the Software to Factory State Using the Restore DVD...............................................	77
	11.2.2.3	Setting up the operating system via the Recovery CD/DVD .......................................................	79
	11.3	Partitioning data media................................................................................................................	81
	11.3.1	Setting up the partitions under Windows Embedded Standard 2009..........................................	81
	11.3.2	Setting up the partitions under Windows XP Professional ..........................................................	82
	11.4	Installing drivers and software .....................................................................................................	83
	11.4.1	Driver installation under Windows Embedded Standard 2009....................................................	83
	11.4.2	Installing drivers and software .....................................................................................................	83
	11.5	Installing updates.........................................................................................................................	84
	11.5.1	Updating the operating system....................................................................................................	84
	11.5.2	Installing or updating application programs and drivers..............................................................	84
	11.5.3	Performing a BIOS update...........................................................................................................	85
	11.6	Data backup.................................................................................................................................	86
	11.6.1	Creating an image........................................................................................................................	86
12	Alarm, error and system messages.........................................................................................................		87
	12.1	Boot error messages....................................................................................................................	87
13	Troubleshooting/FAQs.............................................................................................................................		89
	13.1	General problems ........................................................................................................................	89
	13.2	Problems when using modules of third-party manufacturers ......................................................	90
14	Technical specifications...........................................................................................................................		91
	14.1	General specifications..................................................................................................................	91
	14.2	Power requirements of the components......................................................................................	95
	14.3	Integrated DC power supply ........................................................................................................	96
15	Dimension drawings ................................................................................................................................		97
	15.1	Overview of the dimensional drawings........................................................................................	97
	15.2	Dimension drawings of the device...............................................................................................	98
	15.3	Dimension drawings of the device with mounting brackets.........................................................	99
	15.4	Dimensional drawings of the device with vertical mounting angles...........................................	101
	15.5	Dimensional drawings of the device with expansion frames.....................................................	102
	15.6	Dimension drawing of the blanking plate...................................................................................	103
16	Detailed descriptions .............................................................................................................................		105
	16.1	Internal components ..................................................................................................................	105
	16.1.1	Overview of internal components...............................................................................................	105
	16.1.2	Technical features of the motherboard......................................................................................	106
	16.1.3	External ports.............................................................................................................................	107
	16.1.3.1	Overview....................................................................................................................................	107
	16.1.3.2	COM1/2......................................................................................................................................	107
	16.1.3.3	DVI-I...........................................................................................................................................	108
	16.1.3.4	Ethernet......................................................................................................................................	109
	16.1.3.5	USB............................................................................................................................................	109
	16.1.3.6	PROFIBUS.................................................................................................................................	110
	16.1.3.7	CAN bus.....................................................................................................................................	110
	16.1.4	Internal ports..............................................................................................................................	111
	16.1.4.1	Overview....................................................................................................................................	111
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Table of contents

	16.1.4.2	Compact Flash card interface ...................................................................................................	111
	16.1.4.3 PCI-104 or PC/104-Plus interface (PCI part)............................................................................		112
	16.2	BIOS Setup ...............................................................................................................................	113
	16.2.1	Overview ...................................................................................................................................	113
	16.2.2	Starting BIOS Setup ..................................................................................................................	114
	16.2.3	BIOS Setup menus ...................................................................................................................	115
	16.2.4	Main menu .................................................................................................................................	117
	16.2.5	Advanced Menu ........................................................................................................................	122
	16.2.6	Security menu ...........................................................................................................................	125
	16.2.7	Boot menu .................................................................................................................................	126
	16.2.8	Version menu ............................................................................................................................	130
	16.2.9	Exit Menu ..................................................................................................................................	131
	16.2.10	Default BIOS Setup entries .......................................................................................................	132
	16.3	System resources .....................................................................................................................	135
	16.3.1	Currently allocated system resources .......................................................................................	135
	16.3.2	System resources used by the BIOS/DOS ...............................................................................	136
	16.3.2.1	PCI Interrupt Lines ....................................................................................................................	136
	16.4	I/O Address Areas .....................................................................................................................	137
	16.4.1	Overview of the internal module registers .................................................................................	137
	16.4.2	Watchdog enable register / 066h select register (read/write, address 062h) ...........................	138
	16.4.3	Watchdog trigger register (read only, address 066h) ...............................................................	138
	16.4.4	CAN base address register (write only, address 066h) ............................................................	139
	16.4.5	Output register LED 1 / 2 (read/write, address 404Eh) .............................................................	140
	16.4.6	Battery status tab (read - only, address 50Fh) ............................................................................	141
	16.4.7	SRAM address register .............................................................................................................	142
A	Appendix	................................................................................................................................................	143
	A.1	Guidelines and declarations ......................................................................................................	143
	A.2 .........................................................................................................	Certificates and approvals	144
	A.3 ..................................................................................................................	Service and support	146
B	ESD guidelines......................................................................................................................................		147
	B.1 .........................................................................................................................	ESD Guidelines	147
C	List of abbreviations...............................................................................................................................		149
	C.1 ............................................................................................................................	Abbreviations	149
	Glossary ................................................................................................................................................		155
	Index......................................................................................................................................................		167

6	SIMATIC IPC427C
	Operating Instructions, 04/2009, A5E02414743-01

Introduction

1

1.1Preface

Objective of this documentation

These operating instructions contain all the information you need for commissioning and operation of the SIMATIC IPC427C.

It is intended both for programming and testing personnel who commission the device and connect it with other units (automation systems, programming devices), as well as for service and maintenance personnel who install add-ons or carry out fault/error analyses.

Basic knowledge requirements

A solid background in personal computers and Microsoft operating systems is required to understand this manual. General knowledge in the field automation control engineering is recommended.

Scope of validity of this document

The operating instructions are valid for all supplied variations of the SIMATIC IPC427C and describe the delivery status as of May 2009.

Position in the information landscape

The documentation for the SIMATIC IPC427C includes the following sections:

●SIMATIC IPC427C, Operating Instructions (Compact)

●SIMATIC IPC427C, Operating Instructions

The documentation is supplied in German and English with the device in electronic form as a PDF file on the "Documentation and Drivers" DVD.

Conventions

The term "PC" or "device" is sometimes used to refer to the SIMATIC IPC427C product in this documentation.

History

Currently released versions of this operating manual:

	Edition	Comment
	04/2009	First edition
SIMATIC IPC427C		7
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Introduction

1.2 Guideline to the Operating Instructions

1.2Guideline to the Operating Instructions

Contents format	Table of Contents
Contents	Organization of the documentation, including the index of pages and chapters
Introduction	Purpose, layout and description of the important topics.
Safety instructions	Refers to all the valid technical safety aspects which have to be adhered to while installing,
	commissioning and operating the product/systemin and in reference to statutory
	regulations.
Description	Fields of application, the features and the structure of the product/system
Application planning	Aspects of storage, transport, environmental and EMC conditions to be considered in the
	preparatory stage
Mounting	Product installation options and installation instructions
Connecting	Options of connecting the product and connection instructions
Commissioning	Commissioning the product/system.
Integration	Options of integrating the product into existing or planned system environments/networks
Functions	Monitoring and display functions
Expansions / configurations	Procedure for installing expansion devices (memory, modules).
Maintenance and service	Replacement of hardware components, restoring and setup of the operating system,
	installation of drivers and software
Alarm, error and system	Error messages from booting
messages
Troubleshooting	Problems, cause, remedy
Technical specifications	General specifications in compliance with relevant standards and current/voltage values
Dimension drawings	Dimensions of the device and of modules
Detailed descriptions	Structure, function and features of vital components, distribution of system resources and
	use of the BIOS Setup routine
Appendix	Guidelines and certifications, service and support, notes on retrofitting.
ESD guidelines	General ESD guidelines.

8	SIMATIC IPC427C
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Safety Instructions

2

2.1General safety instructions

CAUTION

Please observe the safety instructions on the back of the cover sheet of this documentation. You should not expand your device unless you have read the relevant safety instructions.

This device is compliant with the relevant safety measures to IEC, EN, VDE, UL, and CSA. If you have questions about the validity of the installation in the planned environment, please contact your service representative.

Repairs

Only authorized personnel are permitted to repair the device.

WARNING

Unauthorized opening of and improper repairs to the device may result in substantial damage to equipment or endanger the user.

System expansions

Only install system expansion devices designed for this device. The installation of other expansions can damage the system and violate the radio-interference suppression regulations. Contact your technical support team or where you purchased your PC to find out which system expansion devices may safely be installed.

CAUTION

If you install or exchange system expansions and damage your device, the warranty becomes void.

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Safety Instructions

2.1 General safety instructions

Battery

This device is equipped with a Lithium battery. Batteries may only be replaced by qualified personnel.

CAUTION

There is the risk of an explosion if the battery is not replaced as directed. Replace the battery only with the same type or with an equivalent type recommended by the manufacturer. Dispose of used batteries in accordance with local regulations.

WARNING

Risk of explosion and release of harmful substances!

For this reason, do not burn lithium batteries, do not solder on the cell body, do not open, do not short circuit, do not reverse polarity, do not heat above 100°C, dispose of correctly, and protect against direct sunlight, dampness and dew.

ESD directives

Modules containing electrostatic sensitive devices (ESDs) can be identified by the following label:

Strictly follow the guidelines mentioned below when handling modules which are sensitive to ESD:

●Always discharge your body´s static electricity before handling modules that are sensitive to ESD (for example, by touching a grounded object).

●All devices and tools must be free of static charge.

●Always pull the mains connector and disconnect the battery before installing or removing modules which are sensitive to ESD.

●Handle modules fitted with ESDs only by their edges.

●Do not touch any connector pins or conductors on modules containing ESDs.

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Description

3

3.1Overview

The SIMATIC IPC427C provides high-level industrial performance.

●Compact design

●Maintenance-free operation

●High degree of ruggedness

Figure 3-1 SIMATIC IPC427C

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Description

3.2 Applications

3.2Applications

The device provides industrial PC systems for high-performance and space-saving applications in particular in the field of machine, systems and switchgear cabinet engineering:

●Measuring and controlling of process and machine data (for example, automated washing systems, assembling machines, packaging machines)

●Operating and visualization tasks with separate display / monitor solutions (information terminals, large-scale displays in automotive production)

●Data logging and processing (for example, system data logging, distributed process control)

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Description

3.3 Features

3.3Features

Basic data
Installation / mounting	• Installation on a DIN rail
	•	Wall mounting
	•	Vertical mountin
	•	Hanging assembly
Processor	• Intel Celeron M 1.2 GHz, 800 MHz FSB, 1 MB SLC or
	• Intel Pentium Core 2 Solo 1.2 GHz, 800 MHz FSB,
		3 MB SLC or
	• Intel Pentium Core 2 Duo 1.2 GHz, 800 MHz FSB,
		3 MB SLC
Main memory	• 512 MB DDR3-SDRAM SODIMM
	• 1 GB DDR3-SDRAM SODIMM
	• 2 GB DDR3-SDRAM SODIMM
	• 4 GB DDR3-SDRAM SODIMM
Free slots for expansion	Up to 3 x PCI/104 modules or 3x PC/104-Plus module
	(PCI bus only);
	installed with expansion frame
Graphics	• Integrated Intel GMA4500 graphics
	• CRT resolution of 640x480 pixels up to 1920x1200
		pixels
	• DVI resolution of 640x480 pixels up to 1920x1200
		pixels
	• 8-512 MB graphics memory taken from main memory
		(dynamic UMA)
Power supply	24 VDC (19.2 – 28.8 V) max. 4 A
Conditions of use	•	Operation without fan
Drives and storage media
Compact Flash card	• 256 MByte optional or
	• 2 GB optional or
	• 4 GB optional or
	•	8 GB optional
Hard disk	≥ 80 GB SATA HD 2.5" optional
SSD (Solid State Disk)	≥ 32 GB optional
Floppy/CDROM drive	Connected via external USB port
USB stick	Connected via external USB port

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Description

3.3 Features

Basic data

Ports

Serial	COM1 (RS232)
	COM2 (RS232); optional
Graphics	DVI-I: combined DVI and VGA
USB	4 x USB 2.0 high current
Ethernet	2 x RJ 45 (10/100/1000 Mbps)
PROFIBUS DP	12 Mbps (isolated potential,
	compatible to CP 5611), optional
CAN interface	Optional
Keyboard, mouse	Connected via external USB port
Monitoring and safety functions
Temperature	• When permitted temperature range is exceeded
	• Warnings can be analyzed by application program
		(local, via LAN)
Watchdog	• Monitoring function for program execution
	• Restart can be parameterized in the event of a fault
	• Warnings can be analyzed by application program
		(local, via LAN)
LED display	4 LEDs for displaying system status
	2 of these can be programmed by the user1
Transient voltage interruption	Up to 15 ms buffer time at full load
Buffer memory	2 MB battery-buffered SRAM1
Software
Operating systems
Available	•	Without
	• Windows Embedded Standard 2009
	• Windows XP Professional MUI SP3 preinstalled 2
Project-specific	•	LINUX
	•	QNX
	•	VxWorks
	•	Others on request
	• RMOS3 V3.40 (ordered separately)

1You can find additional information about addressing the LEDs or the SRAM under a Windows operating system in the section "Output register LED L1/L2". You can find example programs for addressing the LEDs under Windows XP and under RMOS3 under the FAQ at the Customer Support site Industry Automation and Drive Technologies - Homepage (http://www.siemens.com/automation/service&support).

2 MUI: Multi Language User Interface; 5 languages (English, German, French, Spanish, Italian)

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Description

3.4 Windows Embedded Standard 2009

3.4Windows Embedded Standard 2009

The supplied Windows Embedded Standard has the product version 2009. The overview shows the basic device functions under Windows Embedded Standard 2009:

	Function	Hard disk / SSD version	Compact Flash card version
	Enhanced Write Filter (EWF)	In RAM RAM(REG)	In RAM RAM(REG)
	SIMATIC IPC DiagBase	Available V 1.2	Available V 1.2
	Pagefile	Deactivated in favor of the	Deactivated in favor of the EWF
		EWF
	System Restore Core	Available	Available
	File based Writefilter (FBWF)	Available	Available
	Registryfilter	Available	Available
	Device Update Agent (DUA)	Available	Available
	HORM	Available	Available
	Telnet Server	Available	Available
	Windows Backup	Available	Available
	User Mode Driver Framework	Available	Available
	(UMDF)
	MUI	GER/FRA/ITA/SPA	GER
		Default language: English	default language: English
	Administrator Account	Available	Available
	User Account	Available	Available
	Explorer Shell	Available	Available
	Internet Explorer (IE)	Available, IE7	Available, IE7
	Internet Information Server (IIS)	Available V 5.1	Available V 5.1
	Terminal Services	Available	Available
	Bluetooth	Available	Available
	Wireless Network Support	Available	Available
	Windows Firewall	Available	Available
	Windows Security Center	Available	Available
	MSN Explorer	Available	Not available
	Outlook Express	Available	Available
	Administrative Tools	Available	Available
	SMS Advanced Client	Available	Not available
	Remote Desktop	Available V 6.0	Available V 6.0
	Remote Assistance	Available	Available
	.NET Framework	Available, V3.5	Not available
	ASP.NET	Available, V3.5	Not available
	Windows .NET Messenger	Available V 4.7	Available V 4.7
	Code pages/User	Available	Selection available
	Location/Keyboard
	Disk Management Services	Available	Available
	Windows Installer Service	Available V 3.1	Available V 3.1
	Class Installer	Available	Available
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Description

3.4 Windows Embedded Standard 2009

Function	Hard disk / SSD version	Compact Flash card version
CoDevice Installer	Available	Available
Windows Movie Maker	Available V 2.1	Not available
Media Player	Available, V11.0	Available, V11.0
Windows Media Player Tour	Available	Not available
DirectX	V9.0c	V9.0c
Accessories	Available	Available
Help files for all components	Available	Not available
Games	Available	Not available
Fonts	316	118
Windows XP Tour	Available	Not available
Microsoft Silverlight	Available V 1.0	Available V 1.0
NetMeeting	Available V 3.1	Available V 3.1

Note

Activation of "HORM" and creation of a "Hiber File"

When "HORM" is activated, the "Hibernate" function can be used for Windows Embedded Standard 2009:

• EWFMGR C: /activatehorm

"Hibernate" is activated following a restart. The system then always boots from this file.

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Description

3.5 Design

3.5Design

3.5.1External Design

Device components

Pos

Description

Cover plate for Compact Flash module

Connection elementsStatus displays

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Description

3.5 Design

3.5.2Connection components

Ports and power supply

Location of connection elements (version with PROFIBUS or CAN)

Pos	Name	Description
	24 VDC	Connection for a 24 V DC power supply
	DVI/VGA	DVI/VGA connection for CRT or LCD monitor with DVI interface
	USB	4 USB 2.0 connections, high-speed / low current
	PN/IND. ETHERNET	RJ45 Ethernet connection 1 (exclusive PCI interrupt) for 10/100/1000 Mbps
	PN/IND. ETHERNET	RJ45 Ethernet connection 2 (shared PCI interrupt) for 10/100/1000 Mbps
	PROFIBUS DP/MPI	PROFIBUS DP/MPI interface (RS 485 isolated), 9-pin Cannon socket or CAN fieldbus
	CAN fieldbus	(on request)
	COM1	Serial port (RS232) 9-pin Cannon connector
	USB strain-relief	The USB strain relief must be fastened to the device enclosure with an oval-head screw
	fastener	(M4 thread). The USB cables can be fastened to the strain-relief assembly with a cable
		tie.
	PE terminal	The PE terminal (M4 thread) must be connected to the protective ground conductor of the
		plant, in which the device is to be installed. The minimum conductor cross-section may not
		be less than 2,5 mm2.

Location of the connection elements (second COM interface)

Pos	Designation	Description
	COM2	Serial port (RS232) 9-pin Cannon connector
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Description

3.5 Design

3.5.3Operator controls

On/Off switch

CAUTION

The On/Off switch does not disconnect the device from the supply voltage.

Position of on/off switch	Pos	Description
		The on/off switch turns off the output voltages of
		the power supply but not disconnect from the
		supply system.
		The delivery condition is: Power switch turned
		off.

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Description

3.5 Design

3.5.4Status displays

Status displays	LED	Meaning	LED	Description
	PWR	Power supply	OFF	Standby mode
			GREEN	Supply voltage available
	WD	Watchdog status display	OFF	Watchdog disabled Watchdog
			GREEN	enabled, monitoring time not
				expired
				Watchdog enabled, monitoring
			RED	time expired
	L1	User LED L1	OFF	Can be controlled by user
			YELLOW	programs1
	SF		RED
		Group errors	RED	Can be controlled by controller
				program (e.g. WinAC)1
	L2	User LED L2	OFF	Can be controlled by user
			YELLOW	programs1
	RUN/STOP		GREEN
		RUN	GREEN	Can be controlled by controller
		STOP	YELLOW	program (e.g. WinAC)1

1You can find additional information about addressing the LEDs or the SRAM under a Windows operating system in the section "Output register LED L1/L2". Example programs for addressing the LEDs under Windows XP and under RMOS are available under the FAQ at the Customer Support site Industry Automation and Drive Technologies - Homepage (http://www.siemens.com/automation/service&support).

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Application planning

4

4.1Transport

Despite the device's rugged design, its internal components are sensitive to severe vibrations or shock. You must therefore protect the device from severe mechanical stress when transporting it.

You should always use the original packaging for shipping and transporting the device.

CAUTION

Risk of damage to the device!

If you are transporting the device in extreme weather conditions with large fluctuations in temperature, care must be take to ensure that no moisture forms on or in the device (condensation).

If condensation has developed on the device, wait at least 12 hours before you switch it on.

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Application planning

4.2 Unpacking and checking the delivery unit

4.2Unpacking and checking the delivery unit

Unpacking the device

Note the following when unpacking the unit:

●It is advisable not to dispose of the original packing material. Keep it in case you have to transport the unit again.

●Please keep the documentation in a safe place. It is required for initial commissioning and is part of the device.

●Check the delivery unit for any visible transport damage.

●Verify that the shipment contains the complete unit and your separately ordered accessories. Please inform your local dealer of any disagreements or transport damages.

Noting the device identification data

The device can be identified uniquely with the help of these numbers in case of repairs or theft.

Enter the data in the following table:

Serial number	...S VP
Order number of the device	6ES 7647-7B ...
Microsoft Windows Product Key
Ethernet address 1
Ethernet address 2

You can find the corresponding data here:

●Serial number: The serial number is available on the rating plate on the right side of the device.

●Order number of the device: The order number is located on the rating plate.

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Application planning 4.2 Unpacking and checking the delivery unit

●Ethernet address: The Ethernet address of the device is available in your BIOS Setup (F2 function key) under Main > Hardware Options > Ethernet 1 Address or

Ethernet 2 Address.

●Microsoft Windows "Product Key" from the "Certificate of Authenticity" (COA): The COA label is only present in pre-installed Windows Embedded Standard 2009 or

XP Professional and is affixed to the back of the device.

Figure 4-1 COA Label Windows Embedded Standard 2009

Figure 4-2 COA Label Windows XP Pro for Embedded Systems

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Application planning

4.3 Ambient and Environmental Conditions

4.3Ambient and Environmental Conditions

When you plan your project, you should make allowances for:

●The climatic and mechanical environmental conditions specified in the specifications given in your operating instructions.

●The device is approved for operation in closed rooms only.

●Avoid extreme ambient conditions. Protect the device against dust, moisture and heat.

●Do not place the device in direct sunlight.

●Ensure that the distance to other components or the sides of cabinets is at least 50 mm above and 100 mm below the device.

●Do not cover the ventilation slots of the device.

●Always observe the mounting positions permitted for this device.

●The connected or built-in peripherals should not introduce a counter emf in excess of 0.5 V into the device.

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Installing/mounting

5

5.1Permitted mounting positions

NOTICE

The device is approved for operation in closed rooms only.

Ensure that there is a minimum clearance to the other components or the walls of a housing:

•Below at least 100 mm

•Above at least 50 mm

Horizontal (preferred position)	Permitted temperatures
	Operation with hard disk:
	• with up to 3 expansion modules
	(max. load 9 W): +5 to +40°C
	Operation with CompactFlash card and/or SSD drive:
	• with up to 3 expansion modules
	(max. load 9 W): 0 to +45°C
	• with up to 3 expansion modules
	(max. load 9 W) in RAL: 0 to +50°C
	Operation with Compact Flash cards:
	• without expansion modules in RAL: 0 to +55°C
Vertical
(power supply at the top)
	Operation with hard disk:
	• with up to 3 expansion modules
	(max. load 9 W): +5 to +40°C
	With installed Compact Flash card:
	• without expansion modules: 0 to +45°C
	Operation with CompactFlash card and/or SSD drive:
	• with up to 3 expansion modules
	(max. load 9 W) in RAL: 0 to +45°C
	Operation with Compact Flash cards:
	• with up to 3 expansion modules
	(max. load 9 W) in RAL: 0 to +50°C
	Notes:
	When mounted on a DIN rail, the device should be secured
	to prevent shifting (e.g. with a DIN rail ground terminal).

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Installing/mounting

5.1 Permitted mounting positions

Suspended
	Operation with CompactFlash card and/or SSD drive and
	without expansion modules:
	0 to +40°C
	Note:
	Mounting brackets are required if the device is suspended.
Upright mounting	Permitted temperatures
	Operation with hard disk:
	• with up to 3 expansion modules
	(max. load 9 W): +5 to +40°C
	With installed Compact Flash card:
	• without expansion modules: 0 to +45°C
	Operation with CompactFlash card and/or SSD drive:
	• with up to 3 expansion modules
	(max. load 9 W) in RAL: 0 to +45°C
	Operation with Compact Flash cards:
	• with up to 3 expansion modules
	(max. load 9 W) in RAL: 0 to +50°C

RAL = Restricted Access Location

(e.g. installation of the unit in a lockable cabinet)

NOTICE

The safety and installation instructions for the expansion modules should be followed if the device is expanded with PCI-104 / PC/104-plus modules.

If necessary, the device should be installed in an enclosure that meets the requirements of paragraphs 4.6 and 4.7.3 of IEC/UL/EN/DINEN60950-1.

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Installing/mounting 5.2 Mounting information

5.2Mounting information

Before you install the device, read the following mounting instructions.

NOTICE

Adhere to the SIMATIC assembly guidelines and the relevant DIN/VDE requirements or the country-specific regulations when mounting in switching cabinets.

NOTICE

Ensure that the device is classified as "Open Type" when using the device in the area of Industrial Control Equipment (UL508). A UL508 conform enclosure is therefore a mandatory requirement for approval or operation according to UL508.

5.3Mounting the device

Mounting methods

SIMATIC IPC427C can be mounted on DIN rails, with mounting brackets and in an upright position.

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Installing/mounting

5.4 Mounting on DIN rails

5.4Mounting on DIN rails

Mounting the device on DIN rails

Note

Use of Siemens 35 mm standard mounting rail is recommended.

Steps for mounting on DIN rails

1.Set the device inclined on the upper DIN rail.

2.Swing the device fully onto the rails until both clamps completely latch.

Note

To ensure secure mounting on vertical mounting rails, a DIN rail ground terminal should be mounted beneath the device.

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Installing/mounting 5.4 Mounting on DIN rails

NOTICE

The rails are secured to a wall or cabinet similar to mounting with mounting brackets. Ensure that the wall or ceiling can hold four times the total weight of the device (including the rails and additional expansion modules). Also see section Mounting with mounting brackets (Page 30).

Removing the device from the DIN rail

●Push down the device until the clamps release it.

●Swing the device out of the rails.

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Installing/mounting

5.5 Mounting with mounting brackets

5.5Mounting with mounting brackets

Removing mounting clamps from the device

Two mounting clamps are factory installed on the device for DIN rail mounting. These need to be removed before mounting the mounting brackets.

Steps for removing the mounting clamps

Remove the four screws and the two mounting clamps from the back of the device.

Installing brackets on the device

Two mounting brackets are included in the device package. They can be installed on the device with four screws supplied.

Steps for installing the mounting brackets

Install the mounting brackets on the device.

Note Required tools

You need a TORX T20 screwdriver to remove the mounting clamps and mount the mounting brackets.

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