Intel® Solid-State Drive 530 Series (2.5-inch)
Intel® Solid-State Drive 530 Series (2.5-inch)
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Product Specification |
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Capacities: 80 GB, 120 GB, 180 GB, 240 GB, |
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Power Management |
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360 GB, 480 GB |
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5.0 V SATA Supply Rail |
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Components: |
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SATA Link Power Management (LPM) |
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− Intel® 20 nm NAND Flash Memory |
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Device Sleep (DevSleep) |
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Multi-Level Cell (MLC) |
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Power |
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Form Factors: 2.5-inch |
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Active (BAPCo MobileMark* 2007 |
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Thickness: 7 mm |
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Workload): 195 mW |
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Weight: Up to 78 grams |
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Idle3: 125 mW |
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DevSleep: 5 mW |
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SATA 6Gb/s Bandwidth Performance1 |
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(Iometer* Queue Depth 32) |
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Temperature |
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Operating4: 0o C to 70o C |
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− Sustained Sequential Read: up to 540 MB/s |
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Non-Operating: -55o C to 95o C |
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− Sustained Sequential Write: up to 490 |
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Reliability |
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MB/s |
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Read and Write IOPS1 |
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Uncorrectable Bit Error Rate (UBER): |
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(Iometer Queue Depth 32) |
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<1 sector per 1016 bits read |
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− Random 4 KB Reads: up to 41,000 IOPS |
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Mean Time Between Failure (MTBF): |
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− Random 4 KB Writes: up to 80,000 IOPS2 |
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1,200,000 hours |
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Latency (average sequential) |
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— Shock (operating and non-operating): |
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1,500 G/0.5 msec |
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− Read: 80 µs (TYP) |
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Vibration |
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− Write: 85 µs (TYP) |
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Operating: 2.17 GRMS (5-700 Hz) |
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Data Compression |
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— Non-operating: 3.13 GRMS (5-800 Hz) |
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AES 256-bit Encryption |
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Certifications and Declarations: |
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End-to-End Data Protection |
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UL* |
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Compatibility |
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CE* |
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− Intel® SSD Toolbox with Intel® SSD |
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C-Tick* |
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Optimizer |
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BSMI* |
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− Intel® Data Migration Software |
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KCC* |
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− Intel® Rapid Storage Technology |
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Microsoft* WHCK |
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SATA Revision 3.0 |
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VCCI* |
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− ACS-2 (ATA/ATAPI Command Set 2) |
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SATA-IO* |
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− SSD Enhanced SMART ATA feature set |
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Product Ecological Compliance |
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RoHS* |
NOTES:
1.Performance values vary by capacity.
2.Random 4 KB writes measured using out-of-box SSD.
3.Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4.As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper device operating temperatures on heavier workloads.
October 2013 |
Product Specification |
Order Number: 329212-003US |
1 |
Intel® Solid-State Drive 530 Series (2.5-inch)
Ordering Information
Contact your local Intel sales representative for ordering information.
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Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.html
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Copyright © 2013 Intel Corporation. All rights reserved.
Product Specification |
October 2013 |
2 |
Order Number: 329212-003US |
Intel® Solid-State Drive 530 Series (2.5-inch)
Contents
Revision History .................................................................................................................... |
4 |
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1 |
Introduction............................................................................................................... |
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1.1 |
Terminology ................................................................................................................. |
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1.2 |
Reference Documents.................................................................................................... |
7 |
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2 |
Product Specifications................................................................................................ |
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2.1 |
Capacity |
...................................................................................................................... |
8 |
2.2 |
Performance................................................................................................................. |
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2.3 |
Electrical ................................................................................................Characteristics |
9 |
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2.4 |
Environmental .............................................................................................Conditions |
10 |
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2.4.1 ........................................................................ |
Temperature, Shock, Vibration |
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2.4.2 ......................................................................................................... |
Altitude |
10 |
2.5 |
Product Regulatory .....................................................................................Compliance |
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2.6 |
Reliability................................................................................................................... |
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2.7 |
Hot Plug .........................................................................................................Support |
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3 |
Mechanical ...........................................................................................Information |
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4 |
Pin and ......................................................................................Signal Descriptions |
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4.1 |
Pin Locations .............................................................................................................. |
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4.2 |
Signal Descriptions...................................................................................................... |
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4.2.1 .......................................................................Connector Pin Signal Definitions |
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4.2.2 ............................................................................Power Pin Signal Definitions |
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4.3 |
Device Sleep ...................................................................................................Feature |
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5 |
Supported ........................................................................................Command Sets |
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5.1 |
ATA General ...............................................................................Feature Command Set |
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5.2 |
Power Management ..................................................................................................... |
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5.3 |
Security ...........................................................................................Mode Feature Set |
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5.4 |
SMART Command ..................................................................................................Set |
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5.4.1 ........................................................................................... |
SMART Attributes |
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5.4.2 .................................................................................................. |
SMART Logs |
21 |
5.5 |
Device Statistics ......................................................................................................... |
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5.6 |
SMART Command .........................................................................................Transport |
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5.7 |
Data Set ............................................................................Management Command Set |
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5.8 |
Host Protected ................................................................................Area Command Set |
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5.9 |
48-Bit Address .......................................................................................Command Set |
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5.10 |
General Purpose ...............................................................................Log Command Set |
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5.11 |
Native Command ............................................................................................Queuing |
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5.12 |
Software .....................................................................................Settings Preservation |
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5.13 |
SATA Link .............................................................................Power Management (LPM) |
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6 |
Certifications ................................................................................and Declarations |
24 |
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7 |
Appendix.................................................................................................................. |
25 |
October 2013 |
Product Specification |
Order Number: 329212-003US |
3 |
Intel® Solid-State Drive 530 Series (2.5-inch)
Document |
Revision |
Description |
Revision Date |
Number |
Number |
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329212 |
001US |
Initial release |
July 2013 |
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329212 |
002US |
Added 120 GB capacity |
September 2013 |
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329212 |
003US |
Added 80 GB, 360 GB, and 480 GB capacities |
October 2013 |
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Product Specification |
October 2013 |
4 |
Order Number: 329212-003US |
Intel® Solid-State Drive 530 Series (2.5-inch)
This document describes the specifications and capabilities of the Intel® Solid-State Drive 530 Series (Intel® SSD 530 Series).
The Intel SSD 530 Series delivers the next generation storage solution with new low power features designed for Ultrabook™. The next generation Intel SSD continues to provide high performance expected for Serial Advanced Technology Attachment (SATA)-based computers.
The industry-standard 2.5-inch form factor enables interchangeability with existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, and ruggedness offered by an SSD.
The latest feature addition is the DevSleep functionality, a low power drive state controlled by the host via the DevSleep pin. The drive will consume a mere 5 mW while in this state.
As compared to standard SATA HDDs, Intel SSD 530 Series offers these key features:
•High I/O and throughput performance
•Low power consumption
•Increased system responsiveness
•High reliability
•Enhanced ruggedness
The Intel SSD 530 Series also offers additional key features such as:
•Advanced Encryption Standard (AES) 256-bit Encryption
AES 256-bit encryption is an industry standard in data security, providing a hardware-based mechanism for encryption and decryption of user data. Utilizing a 256-bit encryption key, AES encryption—when combined with an ATA drive password—helps protect user data.
•End-to-End Data Protection
End-to-end data protection helps protect data from being corrupted across the data path by using cyclic redundancy check (CRC), parity, and error correction code (ECC) checks in the data path from the host interface to the NAND, and back.
•Data Compression
Data compression helps improve performance and endurance by automatically compressing information sent to the SSD so that less data has to be processed and stored on the NAND. The amount of data that can be compressed depends on the type of data.
October 2013 |
Product Specification |
Order Number: 329212-003US |
5 |
Intel® Solid-State Drive 530 Series (2.5-inch)
Table 1: Terminology
Term |
Description |
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ATA |
Advanced Technology Attachment |
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DAS |
Device Activity Signal |
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DevSleep |
Device Sleep, a new addition to the SATA specification |
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DIPM |
Device Initiated Power Management |
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DMA |
Direct Memory Access |
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EXT |
Extended |
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FPDMA |
First Party Direct Memory Access |
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Gigabyte (1,000,000,000 bytes) |
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Note: The total usable capacity of the SSD may be less than the total physical |
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capacity because a small portion of the capacity is used for NAND flash |
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management and maintenance purposes. |
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HDD |
Hard Disk Drive |
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HIPM |
Host Initiated Power Management |
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I/O |
Input/Output |
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IOPS |
Input/Output Operations Per Second |
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KB |
Kilobyte (1,024 bytes) |
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LBA |
Logical Block Address |
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LPM |
Link Power Management |
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MB |
Megabyte (1,000,000 bytes) |
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MLC |
Multi-level Cell |
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MTBF |
Mean Time Between Failures |
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NCQ |
Native Command Queuing |
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NOP |
No Operation |
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PIO |
Programmed Input/Output |
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RDT |
Reliability Demonstration Test |
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RMS |
Root Mean Squared |
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SATA |
Serial Advanced Technology Attachment |
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SMART |
Self-Monitoring, Analysis and Reporting Technology |
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SSD |
Solid-State Drive |
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TYP |
Typical |
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UBER |
Uncorrectable Bit Error Rate |
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Product Specification |
October 2013 |
6 |
Order Number: 329212-003US |
Intel® Solid-State Drive 530 Series (2.5-inch)
Table 2: Standard References
Date or Rev. # |
Title |
Location |
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May 2005 |
SFF-8201, 2.5-inch drive form factor |
http://www.sffcommittee.org/ |
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May 2006 |
SFF-8223, 2.5-inch Drive w/Serial Attachment |
http://www.sffcommittee.org/ |
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Connector |
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IEC 55022 Information Technology Equipment — |
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Sept 2008 |
Radio disturbance Characteristics— Limits and |
http://www.iec.ch/ |
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methods of measurement CISPR22:2008 |
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(Modified) |
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Dec 2008 |
VCCI |
http://www.vcci.jp/vcci_e/ |
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http://qdms.intel.com/ |
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June 2009 |
RoHS |
Click Search MDDS Database and search |
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for material description datasheet |
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June 2009 |
Serial ATA Revision 3.0 |
http://www.sata-io.org/ |
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August 2009 |
ACS-2 Specification |
http://www.t13.org/ |
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IEC 55024 Information Technology Equipment — |
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August 2010 |
Immunity characteristics— Limits and methods |
http://www.iec.ch/ |
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of measurement CISPR24:2010 |
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Sept 2010 |
Solid-State Drive (SSD) Requirements and |
http://www.jedec.org/standards- |
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Endurance Test Method (JESD218) |
documents/docs/jesd218/ |
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October 2013 |
Product Specification |
Order Number: 329212-003US |
7 |
Intel® Solid-State Drive 530 Series (2.5-inch)
2.1Capacity
Table 3: User Addressable Sectors
Capacity |
Unformatted Capacity (Total User Addressable Sectors in LBA mode) |
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80 GB |
156,301,488 |
120 GB |
234,441,648 |
180 GB |
351,651,888 |
240 GB |
468,862,128 |
360 GB |
703,282,608 |
480 GB |
937,703,088 |
Table 4: Compressible Performance
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Specification |
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Random |
Random |
Random |
Sequential |
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Sequential |
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4 KB Read |
4 KB Write |
4 KB Write |
1 |
1 |
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Capacity |
(up to)1 |
(up to)2 |
(TYP)1 |
128 KB Read |
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128 KB Write |
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IOPS |
IOPS |
IOPS |
MB/s |
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MB/s |
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80 GB |
24,000 |
80,000 |
33,000 |
540 |
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480 |
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120 GB |
24,000 |
80,000 |
37,500 |
540 |
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480 |
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180 GB |
41,000 |
80,000 |
49,000 |
540 |
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490 |
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240 GB |
41,000 |
80,000 |
49,000 |
540 |
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490 |
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360 GB |
45,000 |
80,000 |
33,000 |
540 |
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490 |
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480 GB |
48,000 |
80,000 |
33,000 |
540 |
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490 |
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Note:
1.Performance measured using Iometer* with Queue Depth 32. Measurements are performed on 8 GB of Logical Block Address (LBA) range on a full SSD
2.Random 4 KB writes measured using out-of-box SSD.
Table 5: Incompressible Performance
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Specification |
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Random |
Random |
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Sequential |
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Sequential |
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4 KB Read |
4 KB Write |
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1 |
1 |
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Capacity |
(up to)1 |
(up to)1 |
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128 KB Read |
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128 KB Write |
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IOPS |
IOPS |
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MB/s |
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MB/s |
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80 GB |
20,500 |
13,000 |
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430 |
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100 |
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120 GB |
18,000 |
15,000 |
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450 |
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130 |
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180 GB |
37,500 |
17,000 |
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470 |
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170 |
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240 GB |
37,500 |
23,000 |
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510 |
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230 |
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360 GB |
37,500 |
10,000 |
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525 |
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240 |
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480 GB |
37,500 |
13,000 |
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540 |
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300 |
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Note: |
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1. Performance measured using Iometer* with Queue Depth 32 |
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Product Specification |
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October 2013 |
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8 |
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Order Number: 329212-003US |
Intel® Solid-State Drive 530 Series (2.5-inch)
Table 6: Latency
Specification |
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Intel® SSD 530 Series |
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80 GB |
120 GB |
180 GB |
240 GB |
360 GB |
480 GB |
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Read1 |
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80 µs (TYP) |
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Write1 |
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85 µs (TYP) |
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Power On To Ready2 |
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1 s (TYP) |
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Note:
1.Based on sequential 4 KB using Iometer with Queue Depth 1 workload with compressible (non-random) data pattern. Write Cache enabled.
2.Power On To Ready time assumes proper shutdown
2.3Electrical Characteristics
Table 7: Operating Voltage and Power Consumption
Electrical Characteristics |
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Value |
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80 GB |
120 GB |
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180 GB |
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240 GB |
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360 GB |
480 GB |
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Operating Voltage for 5 V (±5%) |
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Min |
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4.75 V |
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Max |
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5.25 V |
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Rise Time (Max/Min) |
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100 ms / 0.1 ms |
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Fall Time (Max/Min) |
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5 s / 1 ms |
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Noise Tolerance |
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100 mV pp (10 Hz – 30 MHz) |
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Min Off Time1 |
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1 s |
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Power Consumption (TYP) |
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Active2 |
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195 mW |
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Idle3 |
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125 mW |
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DevSleep4 |
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5 mW |
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Thermal Power5 |
2.8 W |
3.1 W |
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3.7 W |
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4.5 W |
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4.5 W |
4.5 W |
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Regulator Power6 |
3.4 W |
3.4 W |
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4.0 W |
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4.9 W |
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5.0 W |
5.0 W |
Note:
1.Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to drive.
2.Active power measured during execution of MobileMark* 2007 with SATA Link Power Management (LPM) enabled.
3.Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4.Power consumption during DevSleep state.
5.Power measured during 128 KB sequential writes with Queue Depth 32 workload using 100 ms sample period. This represents power that would be thermal load on system during heavy workloads.
6.Power measured during 128 KB sequential writes with Queue Depth 32 workload using 500 µs sample period. This represents power that system power supply would have to regulate for proper device operation.
October 2013 |
Product Specification |
Order Number: 329212-003US |
9 |