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Intel® Solid-State Drive 530 Series (2.5-inch)

Intel® Solid-State Drive 530 Series (2.5-inch)

						Product Specification
		Capacities: 80 GB, 120 GB, 180 GB, 240 GB,			Power Management
		360 GB, 480 GB			−	5.0 V SATA Supply Rail
		Components:			−	SATA Link Power Management (LPM)
		− Intel® 20 nm NAND Flash Memory			−	Device Sleep (DevSleep)
		−	Multi-Level Cell (MLC)		Power
		Form Factors: 2.5-inch			−	Active (BAPCo MobileMark* 2007
		Thickness: 7 mm				Workload): 195 mW
		Weight: Up to 78 grams			−	Idle3: 125 mW
					−	DevSleep: 5 mW
	 SATA 6Gb/s Bandwidth Performance1
		(Iometer* Queue Depth 32)			Temperature
					−	Operating4: 0o C to 70o C
		− Sustained Sequential Read: up to 540 MB/s
					−	Non-Operating: -55o C to 95o C
		− Sustained Sequential Write: up to 490
					Reliability
			MB/s	
	 Read and Write IOPS1				—	Uncorrectable Bit Error Rate (UBER):
		(Iometer Queue Depth 32)				<1 sector per 1016 bits read
		− Random 4 KB Reads: up to 41,000 IOPS			—	Mean Time Between Failure (MTBF):
		− Random 4 KB Writes: up to 80,000 IOPS2				1,200,000 hours
		Latency (average sequential)			— Shock (operating and non-operating):
						1,500 G/0.5 msec
		− Read: 80 µs (TYP)
					Vibration
		− Write: 85 µs (TYP)
					—	Operating: 2.17 GRMS (5-700 Hz)
		Data Compression
					— Non-operating: 3.13 GRMS (5-800 Hz)
		AES 256-bit Encryption
					Certifications and Declarations:
		End-to-End Data Protection
					−	UL*
		Compatibility
					−	CE*
		− Intel® SSD Toolbox with Intel® SSD
					−	C-Tick*
			Optimizer
					−	BSMI*
		− Intel® Data Migration Software
					−	KCC*
		− Intel® Rapid Storage Technology
					−	Microsoft* WHCK
		−	SATA Revision 3.0
					−	VCCI*
		− ACS-2 (ATA/ATAPI Command Set 2)
					−	SATA-IO*
		− SSD Enhanced SMART ATA feature set
					Product Ecological Compliance
					−	RoHS*

NOTES:

1.Performance values vary by capacity.

2.Random 4 KB writes measured using out-of-box SSD.

3.Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4.As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper device operating temperatures on heavier workloads.

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Intel® Solid-State Drive 530 Series (2.5-inch)

Ordering Information

Contact your local Intel sales representative for ordering information.

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Copyright © 2013 Intel Corporation. All rights reserved.

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Contents

Revision History ....................................................................................................................			4
1	Introduction...............................................................................................................		5
1.1	Terminology .................................................................................................................		6
1.2	Reference Documents....................................................................................................		7
2	Product Specifications................................................................................................		8
2.1	Capacity	......................................................................................................................	8
2.2	Performance.................................................................................................................		8
2.3	Electrical ................................................................................................Characteristics		9
2.4	Environmental .............................................................................................Conditions		10
	2.4.1 ........................................................................	Temperature, Shock, Vibration	10
	2.4.2 .........................................................................................................	Altitude	10
2.5	Product Regulatory .....................................................................................Compliance		11
2.6	Reliability...................................................................................................................		12
2.7	Hot Plug .........................................................................................................Support		12
3	Mechanical ...........................................................................................Information		13
4	Pin and ......................................................................................Signal Descriptions		14
4.1	Pin Locations ..............................................................................................................		14
4.2	Signal Descriptions......................................................................................................		14
	4.2.1 .......................................................................Connector Pin Signal Definitions		14
	4.2.2 ............................................................................Power Pin Signal Definitions		15
4.3	Device Sleep ...................................................................................................Feature		15
5	Supported ........................................................................................Command Sets		16
5.1	ATA General ...............................................................................Feature Command Set		16
5.2	Power Management .....................................................................................................		17
5.3	Security ...........................................................................................Mode Feature Set		17
5.4	SMART Command ..................................................................................................Set		18
	5.4.1 ...........................................................................................	SMART Attributes	18
	5.4.2 ..................................................................................................	SMART Logs	21
5.5	Device Statistics .........................................................................................................		21
5.6	SMART Command .........................................................................................Transport		22
5.7	Data Set ............................................................................Management Command Set		22
5.8	Host Protected ................................................................................Area Command Set		22
5.9	48-Bit Address .......................................................................................Command Set		22
5.10	General Purpose ...............................................................................Log Command Set		22
5.11	Native Command ............................................................................................Queuing		23
5.12	Software .....................................................................................Settings Preservation		23
5.13	SATA Link .............................................................................Power Management (LPM)		23
6	Certifications ................................................................................and Declarations		24
7	Appendix..................................................................................................................		25

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Intel® Solid-State Drive 530 Series (2.5-inch)

Revision History

Document	Revision	Description	Revision Date
Number	Number
329212	001US	Initial release	July 2013
329212	002US	Added 120 GB capacity	September 2013
329212	003US	Added 80 GB, 360 GB, and 480 GB capacities	October 2013

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Intel® Solid-State Drive 530 Series (2.5-inch)

1 Introduction

This document describes the specifications and capabilities of the Intel® Solid-State Drive 530 Series (Intel® SSD 530 Series).

The Intel SSD 530 Series delivers the next generation storage solution with new low power features designed for Ultrabook™. The next generation Intel SSD continues to provide high performance expected for Serial Advanced Technology Attachment (SATA)-based computers.

The industry-standard 2.5-inch form factor enables interchangeability with existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, and ruggedness offered by an SSD.

The latest feature addition is the DevSleep functionality, a low power drive state controlled by the host via the DevSleep pin. The drive will consume a mere 5 mW while in this state.

As compared to standard SATA HDDs, Intel SSD 530 Series offers these key features:

•High I/O and throughput performance

•Low power consumption

•Increased system responsiveness

•High reliability

•Enhanced ruggedness

The Intel SSD 530 Series also offers additional key features such as:

•Advanced Encryption Standard (AES) 256-bit Encryption

AES 256-bit encryption is an industry standard in data security, providing a hardware-based mechanism for encryption and decryption of user data. Utilizing a 256-bit encryption key, AES encryption—when combined with an ATA drive password—helps protect user data.

•End-to-End Data Protection

End-to-end data protection helps protect data from being corrupted across the data path by using cyclic redundancy check (CRC), parity, and error correction code (ECC) checks in the data path from the host interface to the NAND, and back.

•Data Compression

Data compression helps improve performance and endurance by automatically compressing information sent to the SSD so that less data has to be processed and stored on the NAND. The amount of data that can be compressed depends on the type of data.

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Intel® Solid-State Drive 530 Series (2.5-inch)

1.1Terminology

Table 1: Terminology

	Term	Description
	ATA	Advanced Technology Attachment
	DAS	Device Activity Signal
	DevSleep	Device Sleep, a new addition to the SATA specification
	DIPM	Device Initiated Power Management
	DMA	Direct Memory Access
	EXT	Extended
	FPDMA	First Party Direct Memory Access
		Gigabyte (1,000,000,000 bytes)
	GB	Note: The total usable capacity of the SSD may be less than the total physical
		capacity because a small portion of the capacity is used for NAND flash
		management and maintenance purposes.
	HDD	Hard Disk Drive
	HIPM	Host Initiated Power Management
	I/O	Input/Output
	IOPS	Input/Output Operations Per Second
	KB	Kilobyte (1,024 bytes)
	LBA	Logical Block Address
	LPM	Link Power Management
	MB	Megabyte (1,000,000 bytes)
	MLC	Multi-level Cell
	MTBF	Mean Time Between Failures
	NCQ	Native Command Queuing
	NOP	No Operation
	PIO	Programmed Input/Output
	RDT	Reliability Demonstration Test
	RMS	Root Mean Squared
	SATA	Serial Advanced Technology Attachment
	SMART	Self-Monitoring, Analysis and Reporting Technology
	SSD	Solid-State Drive
	TYP	Typical
	UBER	Uncorrectable Bit Error Rate

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1.2Reference Documents

Table 2: Standard References

	Date or Rev. #	Title	Location
	May 2005	SFF-8201, 2.5-inch drive form factor	http://www.sffcommittee.org/
	May 2006	SFF-8223, 2.5-inch Drive w/Serial Attachment	http://www.sffcommittee.org/
		Connector
		IEC 55022 Information Technology Equipment —
	Sept 2008	Radio disturbance Characteristics— Limits and	http://www.iec.ch/
		methods of measurement CISPR22:2008
		(Modified)
	Dec 2008	VCCI	http://www.vcci.jp/vcci_e/
			http://qdms.intel.com/
	June 2009	RoHS	Click Search MDDS Database and search
			for material description datasheet
	June 2009	Serial ATA Revision 3.0	http://www.sata-io.org/
	August 2009	ACS-2 Specification	http://www.t13.org/
		IEC 55024 Information Technology Equipment —
	August 2010	Immunity characteristics— Limits and methods	http://www.iec.ch/
		of measurement CISPR24:2010
	Sept 2010	Solid-State Drive (SSD) Requirements and	http://www.jedec.org/standards-
		Endurance Test Method (JESD218)	documents/docs/jesd218/

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2 Product Specifications

2.1Capacity

Table 3: User Addressable Sectors

Capacity	Unformatted Capacity (Total User Addressable Sectors in LBA mode)
80 GB	156,301,488
120 GB	234,441,648
180 GB	351,651,888
240 GB	468,862,128
360 GB	703,282,608
480 GB	937,703,088

2.2Performance

Table 4: Compressible Performance

			Specification
	Random	Random	Random	Sequential		Sequential
	4 KB Read	4 KB Write	4 KB Write		1		1
Capacity	(up to)1	(up to)2	(TYP)1	128 KB Read		128 KB Write
	IOPS	IOPS	IOPS	MB/s		MB/s
80 GB	24,000	80,000	33,000	540		480
120 GB	24,000	80,000	37,500	540		480
180 GB	41,000	80,000	49,000	540		490
240 GB	41,000	80,000	49,000	540		490
360 GB	45,000	80,000	33,000	540		490
480 GB	48,000	80,000	33,000	540		490

Note:

1.Performance measured using Iometer* with Queue Depth 32. Measurements are performed on 8 GB of Logical Block Address (LBA) range on a full SSD

2.Random 4 KB writes measured using out-of-box SSD.

Table 5: Incompressible Performance

		Specification
	Random	Random		Sequential		Sequential
	4 KB Read	4 KB Write			1		1
Capacity	(up to)1	(up to)1		128 KB Read		128 KB Write
	IOPS	IOPS		MB/s		MB/s
80 GB	20,500	13,000		430		100
120 GB	18,000	15,000		450		130
180 GB	37,500	17,000		470		170
240 GB	37,500	23,000		510		230
360 GB	37,500	10,000		525		240
480 GB	37,500	13,000		540		300
Note:
1. Performance measured using Iometer* with Queue Depth 32
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Intel® Solid-State Drive 530 Series (2.5-inch)

Table 6: Latency

Specification			Intel® SSD 530 Series
	80 GB	120 GB	180 GB	240 GB	360 GB	480 GB
Read1			80 µs (TYP)
Write1			85 µs (TYP)
Power On To Ready2			1 s (TYP)

Note:

1.Based on sequential 4 KB using Iometer with Queue Depth 1 workload with compressible (non-random) data pattern. Write Cache enabled.

2.Power On To Ready time assumes proper shutdown

2.3Electrical Characteristics

Table 7: Operating Voltage and Power Consumption

Electrical Characteristics				Value
	80 GB	120 GB		180 GB		240 GB		360 GB	480 GB
Operating Voltage for 5 V (±5%)
Min				4.75 V
Max				5.25 V
Rise Time (Max/Min)				100 ms / 0.1 ms
Fall Time (Max/Min)				5 s / 1 ms
Noise Tolerance			100 mV pp (10 Hz – 30 MHz)
Min Off Time1					1 s
Power Consumption (TYP)
Active2				195 mW
Idle3				125 mW
DevSleep4				5 mW
Thermal Power5	2.8 W	3.1 W		3.7 W		4.5 W		4.5 W	4.5 W
Regulator Power6	3.4 W	3.4 W		4.0 W		4.9 W		5.0 W	5.0 W

Note:

1.Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to drive.

2.Active power measured during execution of MobileMark* 2007 with SATA Link Power Management (LPM) enabled.

3.Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4.Power consumption during DevSleep state.

5.Power measured during 128 KB sequential writes with Queue Depth 32 workload using 100 ms sample period. This represents power that would be thermal load on system during heavy workloads.

6.Power measured during 128 KB sequential writes with Queue Depth 32 workload using 500 µs sample period. This represents power that system power supply would have to regulate for proper device operation.

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