Intel® Solid-State Drive DC S3500 Series
Product Specification
Capacity:
−2.5-inch: 80/120/160/240/300/480/600/800 GB
−1.8-inch: 80/240/400/800 GB
Components:
−Intel® 20nm NAND Flash Memory
−Multi-Level Cell (MLC)
Form Factor: 2.5–inch and 1.8-inch
Read and Write IOPS1,2 (Full LBA Range, Iometer* Queue Depth 32)
−Random 4 KB3 Reads: Up to 75,000 IOPS
−Random 4 KB Writes: Up to 11,500 IOPS
−Random 8 KB3 Reads: Up to 47,500 IOPS
−Random 8 KB Writes: Up to 5,500 IOPS
Bandwidth Performance1
−Sustained Sequential Read: Up to 500 MB/s4
−Sustained Sequential Write: Up to 450 MB/s
Latency (average sequential)
−Read: 50 µs (TYP)
−Write: 65 µs (TYP)
Quality of Service5, 6
−Read/Write: 500 µs / 5 ms (99.9%)
AES 256-bit Encryption
Compliance
−SATA Revision 3.0; compatible with SATA 6Gb/s, 3Gb/s and 1.5Gb/s interface rates
−ATA8-ACS2; includes SCT (Smart Command Transport) and device statistics log support
−Enhanced SMART ATA feature set
−Native Command Queuing (NCQ) command set
−Data set management Trim command
Compatibility
−Windows 7 and Windows 8
−Windows Server 2012
−Windows Server 2008 Enterprise 32/64bit SP2
−Windows Server 2008 R2 SP1
−Windows Server 2003 Enterprise R2 64bit SP2
−Red Hat Enterprise Linux* 5.5, 5.6, 6.1, 6.3
−SUSE* Linux Enterprise Server 10, 11 SP1
−CentOS 64bit 5.7, 6.3
−Intel® SSD Toolbox with Intel® SSD Optimizer
Product Ecological Compliance
−RoHS*
Power Management
−2.5 inch: 5 V or 12 V SATA Supply Rail7
−1.8 inch: 3.3 V SATA Supply Rail
−SATA Interface Power Management
−OS-aware hot plug/removal
−Enhanced power-loss data protection
Power
−Active: Up to 5.0 W (TYP)
−Idle: 650 mW8
Weight:
−2.5-inch 80-240 GB: 70 grams ± 2 grams
−2.5-inch 300-800 GB: 72 grams ± 2 grams
−1.8-inch 80 GB: 35 grams ± 2 grams
−1.8-inch 240-800 GB: 37 grams ± 2 grams
Temperature
−Operating: 0° C to 70° C
−Non-Operating9: -55° C to 95° C
−Temperature monitoring and logging
−Thermal throttling
Shock (operating and non-operating):
1,000 G/0.5 msec
Vibration
−Operating: 2.17 GRMS (5-700 Hz)
−Non-Operating: 3.13 GRMS (5-800 Hz)
Altitude (simulated)
−Operating: -1,000 to 10,000ft
−Non-Operating: -1,000 to 40,000ft
Reliability
−Uncorrectable Bit Error Rate (UBER):
−1 sector per 1017 bits read
−Mean Time Between Failures (MTBF): 2,000,000 hours
−End-to-End data protection
Endurance Rating10:
− 80 GB: 45 TBW |
– 120 GB: 70 TBW |
− 160 GB: 100 TBW |
– 240 GB: 140 TBW |
− 300 GB: 170 TBW |
– 400 GB: 225 TBW |
− 480 GB: 275 TBW |
– 600 GB: 330 TBW |
−800 GB: 450 TBW
Certifications and Declarations
−UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft* WHCK, VCCI*, SATA-IO
1.Performance values vary by capacity and form factor
2.Performance specifications apply to both compressible and incompressible data
3.4 KB = 4,096 bytes; 8 KB = 8,192 bytes
4.MB/s = 1,000,000 bytes/second.
5.Based on Random 4KB QD=1 workload, measured as the time taken for 99.9 percentile of commands to finish the round-trip from host to drive and back to host
6.Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability
7.Defaults to 12V, if both 12V and 5V are present
8.Based on 5V supply
9.Please contact your Intel representative for details on the non-operating temperature range
10.Based on JESD218 standard
December 2013
Order Number: 328860-003US
Intel® Solid-State Drive DC S3500
Ordering Information
Contact your local Intel sales representative for ordering information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm
Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others.
Copyright © 2013 Intel Corporation. All rights reserved.
Product Specification |
December 2013 |
2 |
328860-003US |
Intel® Solid-State Drive DC S3500
Contents
Revision History .............................................................................................................................. |
4 |
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Terms and Acronyms....................................................................................................................... |
4 |
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1.0 |
Overview ............................................................................................................................. |
6 |
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2.0 |
Product Specifications .......................................................................................................... |
7 |
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2.1 |
Capacity............................................................................................................................... |
7 |
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2.2 |
Performance........................................................................................................................ |
7 |
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2.3 |
Electrical Characteristics ..................................................................................................... |
9 |
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2.4 |
Environmental Conditions................................................................................................. |
12 |
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2.5 |
Product Regulatory Compliance........................................................................................ |
12 |
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2.6 |
Reliability........................................................................................................................... |
13 |
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2.7 |
Temperature Sensor.......................................................................................................... |
14 |
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2.8 |
Power Loss Capacitor Test ................................................................................................ |
14 |
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2.9 |
Hot Plug Support ............................................................................................................... |
14 |
3.0 |
Mechanical Information ..................................................................................................... |
15 |
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4.0 |
Pin and Signal Descriptions................................................................................................. |
17 |
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4.1 |
2.5-inch Form Factor Pin Locations................................................................................... |
17 |
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4.2 |
1.8-inch Form Factor Pin Locations................................................................................... |
17 |
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4.3 |
Connector Pin Signal Definitions....................................................................................... |
18 |
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4.4 |
Power Pin Signal Definitions ............................................................................................. |
18 |
5.0 |
Supported Command Sets .................................................................................................. |
20 |
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5.1 |
ATA General Feature Command Set ................................................................................. |
20 |
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5.2 |
Power Management Command Set.................................................................................. |
20 |
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5.3 |
Security Mode Feature Set................................................................................................ |
20 |
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5.4 |
SMART Command Set ....................................................................................................... |
21 |
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5.5 |
Device Statistics................................................................................................................. |
26 |
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5.6 |
SMART Command Transport (SCT).................................................................................... |
27 |
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5.7 |
Data Set Management Command Set............................................................................... |
27 |
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5.8 |
Host Protected Area Command Set .................................................................................. |
27 |
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5.9 |
48-Bit Address Command Set............................................................................................ |
28 |
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5.10 |
General Purpose Log Command Set.................................................................................. |
28 |
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5.11 |
Native Command Queuing................................................................................................ |
28 |
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5.12 |
Software Settings Preservation......................................................................................... |
28 |
6.0 |
Certifications and Declarations ........................................................................................... |
29 |
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7.0 |
References ......................................................................................................................... |
29 |
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Appendix A: IDENTIFY DEVICE Command Data ............................................................................... |
30 |
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December 2013 |
Product Specification |
||
328860-002US |
|
3 |
Intel® Solid-State Drive DC S3500
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Date |
Revision |
Description |
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April 2013 |
001 |
Initial release. |
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1. |
Random write IOPS consistency changes from 75% to 80% |
June 2013 |
002 |
2. |
Added read power in table 8, 9 and 11 |
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3. |
Added X,Y, Z dimension in section 3.0 |
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1. |
Updated Section 5.4.1 Timed Workload Endurance Indicators with user notes |
December 2013 |
003 |
2. |
Updated Table 6 notes |
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3. |
Updated Table 23 |
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Term |
Definition |
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ATA |
Advanced Technology Attachment |
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CRC |
Cyclic Redundancy Check |
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DAS |
Device Activity Signal |
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DMA |
Direct Memory Access |
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ECC |
Error Correction Code |
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EXT |
Extended |
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FPDMA |
First Party Direct Memory Access |
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Gigabyte |
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GB |
Note: The total usable capacity of the SSD may be less than the total physical capacity because a small |
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portion of the capacity is used for NAND flash management and maintenance purposes. |
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Gb |
Gigabit |
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HDD |
Hard Disk Drive |
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HET |
High Endurance Technology |
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KB |
Kilobyte |
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I/O |
Input/Output |
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IOPS |
Input/Output Operations Per Second |
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ISO |
International Standards Organization |
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LBA |
Logical Block Address |
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MB |
Megabyte (1,000,000 bytes) |
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MLC |
Multi-level Cell |
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MTBF |
Mean Time Between Failures |
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NCQ |
Native Command Queuing |
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NOP |
No Operation |
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PB |
Petabyte |
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PCB |
Printed Circuit Board |
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PIO |
Programmed Input/Output |
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RDT |
Reliability Demonstration Test |
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RMS |
Root Mean Square |
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SATA |
Serial Advanced Technology Attachment |
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SCT |
SMART Command Transport |
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Product Specification |
December 2013 |
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4 |
328860-003US |
Intel® Solid-State Drive DC S3500
Term |
Definition |
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Self-Monitoring, Analysis and Reporting Technology |
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SMART |
An open standard for developing hard drives and software systems that automatically monitors the |
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health of a drive and reports potential problems. |
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SSD |
Solid-State Drive |
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TB |
Terabyte |
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TYP |
Typical |
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UBER |
Uncorrectable Bit Error Rate |
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December 2013 |
Product Specification |
328860-002US |
5 |
Intel® Solid-State Drive DC S3500
This document describes the specifications and capabilities of the Intel® SSD DC S3500.
The Intel® SSD DC S3500 delivers leading performance and Quality of Service combined with world-class reliability for Serial Advanced Technology Attachment (SATA)-based computers in nine capacities: 80 GB, 120 GB, 160 GB, 240 GB, 300 GB, 400 GB, 480 GB, 600 GB and 800 GB.
By combining 20nm Intel® NAND Flash Memory technology with SATA 6Gb/s interface support, the Intel® SSD DC S3500 delivers sequential read speeds of up to 500 MB/s and sequential write speeds of up to 450 MB/s. Intel SSD DC S3500 delivers Quality of Service of 500 us for random 4KB reads measured at a queue depth of 1.
The industry-standard 2.5-inch and 1.8-inch form factors enable interchangeability with existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, ruggedness, and power savings offered by an SSD.
Intel SSD DC S3500 offers these key features:
•Standard Endurance Technology
•High I/O and throughput performance
•Consistent I/O latency
•Enhanced power-loss data protection
•End-to-End data protection
•Thermal throttling
•Temperature Sensor
•Inrush current management
•Low power
•High reliability
•Enhanced ruggedness
•Temperature monitor and logging
•Power loss protection capacitor self-test
Product Specification |
December 2013 |
6 |
328860-003US |
Intel® Solid-State Drive DC S3500
Table 1. |
User Addressable Sectors |
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Intel SSD DC S3500 |
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Unformatted Capacity |
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(Total User Addressable Sectors in LBA Mode) |
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80 GB |
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156,301,488 |
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120 GB |
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234,441,648 |
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160 GB |
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312,581,808 |
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240 GB |
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468,862,128 |
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300 GB |
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586,072,368 |
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400 GB |
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781,422,768 |
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480 GB |
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937,703,088 |
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600 GB |
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1,172,123,568 |
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800 GB |
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1,562,824,368 |
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Notes: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes.
LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive.
The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.
Table 2. Random Read/Write Input/Output Operations Per Second (IOPS)
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Intel SSD DC S3500 |
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Specification1 |
Unit |
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80 GB |
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240 GB |
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400 GB |
480 |
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800 GB |
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(2.5/ |
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120 GB |
160 GB |
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(2.5”/ |
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300 GB |
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(2.5”/ |
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(1.8”) |
/600 GB |
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1.8”) |
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1.8”) |
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1.8”) |
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Random 4 |
KB Read (up to)2 |
IOPS |
70,000 |
75,000 |
75,000 |
75,000 |
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75,000 |
75,000 |
75,000 |
75,000 |
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Random 4 KB Write (up to) |
IOPS |
7,000 |
4,600 |
7,500 |
7,500 |
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9,000 |
11,000 |
11,000 |
11,500 |
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Random 8 |
KB Read (up to)3 |
IOPS |
39,000 |
47,000 |
47,500 |
47,500 |
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47,500 |
47,500 |
47,500 |
47,500 |
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Random 8 |
KB Write (up to) |
IOPS |
3,700 |
2,300 |
3,800 |
3,800 |
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4,400 |
5,500 |
5,500 |
5,500 |
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Notes: 1. Performance measured using Iometer* with Queue Depth 32. Measurements are performed on a full Logical Block Address (LBA) span of the drive.
2.4 KB = 4,096 bytes
3.8 KB = 8,192 bytes
4. Performance consistency measured using Iometer* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability
December 2013 |
Product Specification |
328860-002US |
7 |
Intel® Solid-State Drive DC S3500
Table 3. |
Random Read/Write IOPS Consistency |
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Intel SSD DC S3500 |
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Specification4 |
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Unit |
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80GB |
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240GB |
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400GB |
480 / |
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800GB |
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(2.5/ |
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120GB |
160GB |
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(2.5”/ |
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300GB |
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(2.5”/ |
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(1.8”) |
600 GB |
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1.8”) |
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1.8”) |
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1.8”) |
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Random 4 |
KB Read (up to)2 |
% |
90 |
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90 |
90 |
90 |
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90 |
90 |
90 |
90 |
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Random 4 KB Write (up to) |
% |
80 |
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80 |
80 |
80 |
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80 |
80 |
80 |
80 |
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Random 8 |
KB Read (up to)3 |
% |
90 |
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90 |
90 |
90 |
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90 |
90 |
90 |
90 |
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Random 8 |
KB Write (up to) |
% |
80 |
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80 |
80 |
80 |
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80 |
80 |
80 |
80 |
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Notes: 1. Performance measured using Iometer* with Queue Depth 32. Measurements are performed on a full Logical Block
Address (LBA) span of the drive.
2.4 KB = 4,096 bytes
3.8 KB = 8,192 bytes
4. Performance consistency measured using Iometer* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state, including all background activities required for normal operation and data reliability
Table 4. |
Sequential Read and Write Bandwidth |
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Intel SSD DC S3500 |
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Specification |
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Unit |
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80GB |
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240GB |
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400GB |
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480 |
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800GB |
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(2.5/ |
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120GB |
160GB |
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(2.5”/ |
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300GB |
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/600 |
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(2.5”/ |
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(1.8”) |
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1.8”) |
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1.8”) |
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GB |
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1.8”) |
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Sequential Read (SATA |
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MB/s |
340 |
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445 |
475 |
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500 |
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500 |
500 |
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500 |
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500 |
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6Gb/s)1 |
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Sequential Write (SATA |
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MB/s |
100 |
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135 |
175 |
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260 |
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315 |
380 |
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410 |
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450 |
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6Gb/s)1 |
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Notes: 1. Performance measured using Iometer* with 128 KB (131,072 bytes) of transfer size with Queue Depth 32. |
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Table 5. |
Latency |
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Intel SSD DC S3500 |
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Specification |
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80GB (2.5/1.8”), 120GB, 160GB, 240GB (2.5”/1.8”), |
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800GB (2.5”/1.8”) |
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300GB, 400GB (1.8”), 480GB, 600 GB |
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Latency1 (TYP) |
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50 µs |
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Read |
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50 µs |
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65 µs |
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Write |
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65 µs |
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2.0 s |
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Power On to Ready2 |
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3.0 s |
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Product Specification |
December 2013 |
8 |
328860-003US |
Intel® Solid-State Drive DC S3500
Table 6. |
Quality of Service |
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Intel SSD DC S3500 |
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Specification |
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Unit |
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Queue Depth=1 |
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Queue Depth=32 |
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80/120/160/ |
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300/400/480/ |
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80/120/160/ |
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300/400/480/ |
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240 GB |
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600/800 GB |
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240 GB |
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600/800 GB |
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Quality of Service3, 4 (99.9%) |
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Reads |
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ms |
0.5 |
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0.5 |
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2 |
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2 |
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Writes |
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ms |
5 |
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2 |
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20 |
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10 |
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Quality of Service3,4 (99.9999%) |
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Reads |
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ms |
10 |
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5 |
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10 |
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5 |
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Writes |
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ms |
10 |
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10 |
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30 |
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30 |
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Notes:
1.Device measured using Iometer. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential workload.
2.Power On To Ready time assumes proper shutdown. Time varies if shutdown is not preceded by STANDBY IMMEDIATE command. For 95% of the time, the maximum time for power on to ready will be less than 10 seconds.
3.Device measured using Iometer. Quality of Service measured using 4 KB (4,096 bytes) transfer size on a random workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.
4.Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the round-trip from host to drive and back to host.
2.3Electrical Characteristics
Table 7. |
Operating Voltage for 2.5-inch Form Factor |
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Intel SSDDC S3500 |
Electrical Characteristics |
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80 GB, 120 GB, 160 GB, 240 GB, 300 GB, 480 GB, 600 GB, 800 GB |
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5 V Operating Characteristics: |
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Operating Voltage range |
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5 V (±5%) |
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Rise time (Max/Min) |
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1 s / 1 ms |
Fall time (Min)2 |
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1 ms |
Noise level |
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500 mV pp 10 Hz – 100 KHz |
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50 mV pp 100 KHz – 20 MHz |
Min Off time3 |
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500 ms |
Inrush Current (Typical Peak) 1 |
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1.0 A, < 1 s |
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12 V Operating Characteristics: |
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Operating Voltage range |
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12 V (±10%) |
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Rise time (Max/Min) |
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1 s / 1 ms |
Fall time (Min)2 |
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1 ms |
Noise level |
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1000 mV pp 10 Hz – 100 KHz |
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100 mV pp 100 KHz – 20 MHz |
Min Off time3 |
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500 ms |
Inrush Current (Typical Peak) 1 |
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1.0 A, < 1 s |
Notes:
1.Measured from initial device power supply application.
2 Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management.
3.The drive needs to be powered off for at least 500msec before powering on.
December 2013 |
Product Specification |
328860-002US |
9 |
Intel® Solid-State Drive DC S3500
Table 8. Power Consumption for 2.5-inch Form Factor (5V Supply)
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Intel SSD DC S3500 |
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Specification |
Unit |
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80 GB |
120 GB |
160 GB |
240 GB |
300 GB |
480 GB |
600 GB |
800 GB |
Active Write - RMS Average 1 |
W |
1.8 |
2.0 |
2.3 |
2.9 |
3.5 |
4.3 |
4.5 |
5.0 |
Active Write - RMS Burst 2 |
W |
2.0 |
2.4 |
2.7 |
3.2 |
3.9 |
5.2 |
5.5 |
7.3 |
Active Read - RMS Average 3 |
W |
1.5 |
1.5 |
1.6 |
1.6 |
1.6 |
1.6 |
1.6 |
1.6 |
Active Read - RMS Burst 4 |
W |
1.8 |
2.2 |
2.5 |
2.8 |
3.0 |
3.3 |
3.4 |
3.5 |
Idle |
W |
0.6 |
0.6 |
0.6 |
0.6 |
0.6 |
0.6 |
0.6 |
0.6 |
Notes:
1.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is measured using scope trigger over a 100 ms sample period.
2.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured using scope trigger over a 500 us sample period.
3.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. Root Mean Squared (RMS) average power is measured using scope trigger over a 100 ms sample period.
4.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. Root Mean Squared (RMS) burst power is measured using scope trigger over a 500 us sample period.
Table 9. |
Power Consumption for 2.5-inch Form Factor (12V Supply) |
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|
Intel SSD DC S3500 |
|
|
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|||||
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||||||
Specification1 |
|
Unit |
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80 GB |
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120 GB |
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160 GB |
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240 GB |
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300 GB |
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480 GB |
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600 GB |
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800 GB |
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Active Write - RMS Average1 |
W |
2.0 |
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2.3 |
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2.5 |
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3.1 |
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3.5 |
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4.3 |
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4.5 |
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5.0 |
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Active Write - RMS Burst2 |
W |
2.2 |
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2.5 |
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2.8 |
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3.4 |
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4.2 |
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5.5 |
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6.8 |
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7.8 |
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|
Active Read - RMS Average3 |
W |
1.6 |
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1.6 |
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1.7 |
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1.7 |
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1.7 |
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1.7 |
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1.7 |
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1.8 |
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|
Active Read - RMS Burst4 |
W |
2.1 |
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2.3 |
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2.6 |
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3.2 |
|
3.6 |
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|
3.6 |
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3.6 |
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6.4 |
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|
Idle |
|
W |
0.8 |
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0.8 |
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0.9 |
|
0.9 |
|
0.9 |
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|
0.9 |
|
0.9 |
|
0.9 |
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Notes:
1.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average power is measured using scope trigger over a 100 ms sample period.
2.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power is measured using scope trigger over a 500 us sample period.
3.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. Root Mean Squared (RMS) average power is measured using scope trigger over a 100 ms sample period.
4.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. Root Mean Squared (RMS) burst power is measured using scope trigger over a 500 us sample period.
Product Specification |
December 2013 |
10 |
328860-003US |