Intel Core 2 Duo User Manual

Intel® CoreTM 2 Duo Processor and

Intel ® Q35 Express Chipset

Development Kit

User’s Manual

October 2007

Order Number: 318476-001US

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The Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Hyper-Threading Technology requires a computer system with an Intel® Pentium® 4 processor supporting HT Technology and a HT Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See http://www.intel.com/ products/ht/Hyperthreading_more.htm for additional information.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com.

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*Other names and brands may be claimed as the property of others. Copyright © 2007, Intel Corporation. All Rights Reserved.

Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit
User’s Manual	October 2007
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Contents—Intel Core 2 Duo Processor and Intel Q35 Express Chipset

Contents

1.0 About This Manual .....................................................................................................			6
1.1	Content Overview................................................................................................		6
1.2	Text Conventions ................................................................................................		6
1.3	Glossary of Terms and Acronyms...........................................................................		7
1.4	Support Options..................................................................................................		8
	1.4.1	Electronic Support Systems .......................................................................	8
	1.4.2	Additional Technical Support ......................................................................	8
1.5	Product Literature ...............................................................................................		8
2.0 Development Kit Hardware Features .......................................................................			10
2.1	Intel® Q35 Express Chipset Development Kit Overview..........................................		10
2.2	System Block Diagram .......................................................................................		11
2.3	Development Kit Inventory Checklists ..................................................................		12
2.4	Processor Support .............................................................................................		14
2.5	System Memory ................................................................................................		14
	2.5.1 Dual Channel (Interleaved) Mode Configurations ........................................		15
	2.5.2 Single Channel (Asymmetric) Mode Configurations......................................		17
2.6	Back-Panel Connectors.......................................................................................		18
	2.6.1	Audio-Connectors...................................................................................	18
	2.6.2 RJ-45 LAN Connector with Integrated LEDs................................................		19
	2.6.3	USB Port ...............................................................................................	19
	2.6.4 Coaxial S/PDIF In/Out Connector..............................................................		19
	2.6.5	eSATA Port ............................................................................................	19
2.7	Debug Features.................................................................................................		20
	2.7.1	Extended Debug Probe (XDP)...................................................................	20
	2.7.2	Power LEDs ...........................................................................................	20
	2.7.3 Port 80 POST Code LEDs .........................................................................		20
	2.7.4	Voltage Reference ..................................................................................	21
2.8	Development Kit Major Connectors and Jumpers....................................................		21
	2.8.1	Jumper Functions ...................................................................................	22
	2.8.2 USB 2.0 Front Panel ...............................................................................		22
	2.8.3	1394a Header ........................................................................................	22
2.9	SPI Removal / Installation Technique ...................................................................		23
	2.9.1	SPI Device Removal................................................................................	24
	2.9.2	SPI Device Installation ............................................................................	24
3.0 Setting Up and Configuring the Development Kit .....................................................			26
3.1	Overview .........................................................................................................		26
3.2	Installing Board Standoffs ..................................................................................		26
3.3	BTX Heatsink Setup with SRM .............................................................................		28
	3.3.1 SRM Alignment on any BTX Board ............................................................		28
3.4	Board Setup and Configuration before Boot...........................................................		30
3.5	Post Codes Definitions........................................................................................		32
	3.5.1	Normal Post Codes .................................................................................	32

Figures

1	Board Features ........................................................................................................	11
2	Intel® Q35 Express Chipset Development Kit block diagram ..........................................	12
3	Memory Channel and DIMM Configuration ...................................................................	15
4	Dual Channel (Interleaved) Mode Configuration with 2x DIMMs ......................................	16
5	Dual Channel (Interleaved) Mode Configuration with 3x DIMMs ......................................	16
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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Contents

6	Dual Channel (Interleaved) Mode Configuration with 4x DIMMs.......................................	17
7	Single Channel (Asymmetric) Mode Configuration with 1x DIMM .....................................	17
8	Single Channel (Asymmetric) Mode Configuration with 3x DIMMs....................................	18
9	Back-panel Connectors..............................................................................................	18
10	LAN Connector LED locations......................................................................................	19
11	ITP-XDP Connector location (J2BC) .............................................................................	20
12	Major Jumper and Header Locations............................................................................	21
13	Location for 1394a Header and USB Front Panel ...........................................................	23
14	SPI Socket with Retaining Clip....................................................................................	24
15	SPI Device Installation ..............................................................................................	25
16	Intel® Q35 Development Kits ....................................................................................	26
17	Mounting Hole Locations............................................................................................	27
18	Mounting the Standoff for BTX Heatsink.......................................................................	28
19	Casing with “Support and Retention Module” ................................................................	28
20	BTX board alignment on SRM .....................................................................................	29
21	Heatsink Alignment...................................................................................................	29
22	Tightening Heatsink on the SRM and Board ..................................................................	30
23	CPU Fan location ......................................................................................................	31
24	2x12 Standard power supply and 2x2 power supply ......................................................	32
Tables
1	Definition .................................................................................................................	7
2	Intel Literature Centers ..............................................................................................	9
3	Development Kit Hardware Items ...............................................................................	12
4	Development Kit Board Specification ...........................................................................	13
5	Internal I/O headers .................................................................................................	13
6	Supported Intel Technologies .....................................................................................	13
7	Additional Features ...................................................................................................	14
8	LAN Connector LED status .........................................................................................	19
9	Voltage Reference detail............................................................................................	21
10	Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit Board
	Jumpers Description .................................................................................................	22
11	USB Front Panel .......................................................................................................	22
12	1394a Header ..........................................................................................................	23

Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit
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Revision History—Intel Core 2 Duo Processor and Intel Q35 Express Chipset

Revision History

Date	Revision	Description
October 2007	001	Initial release

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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—About This Manual

1.0About This Manual

This user’s manual describes the use of the Intel® Q35 Express Chipset Development Kit. This manual has been written for OEMs, system evaluators, and embedded system developers. All jumpers, headers, LED functions, and their locations on the board, along with subsystem features and POST codes, are defined in this document.

For the latest information about the Intel® Q35 Express Chipset Development Kit reference platform, visit:

http://developer.intel.com/design/intarch/devkits/ index.htm?iid=embed_body+devkits

For design documents related to this platform, such as schematics and layout, please contact your Intel Representative.

1.1Content Overview

Chapter 1.0, “About This Manual”

This chapter contains a description of conventions used in this manual. The last few sections explain how to obtain literature and contact customer support.

Chapter 2.0, “Development Kit Hardware Features”

This chapter provides information on the development kit features and the board capability. This includes the information on board component features, jumper settings, pin-out information for connectors and overall development kit board capability.

Chapter 3.0, “Setting Up and Configuring the Development Kit”

This chapter provides instructions on how to configure the evaluation board and processor assembly by setting BTX heatsink, jumpers, connecting peripherals, providing power, and configuring the BIOS.

1.2Text Conventions

The following notations may be used throughout this manual.

#	The pound symbol (#) appended to a signal name indicates that
	the signal is active low.
Variables	Variables are shown in italics. Variables must be replaced with
	correct values.
Instructions	Instruction mnemonics are shown in uppercase. When you are
	programming, instructions are not case-sensitive. You may use
	either upper-case or lower-case.
Numbers	Hexadecimal numbers are represented by a string of
	hexadecimal digits followed by the character H. A zero prefix is
	added to numbers that begin with A through F. (For example, FF
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About This Manual—Intel Core 2 Duo Processor and Intel Q35 Express Chipset

is shown as 0FFH.) Decimal and binary numbers are represented by their customary notations (That is, 255 is a decimal number and 1111 1111 is a binary number). In some cases, the letter B is added for clarity.

Units of Measure	The following abbreviations are used to represent units of
	measure:
	GByte	gigabytes
	KByte	kilobytes
	MByte	megabytes
	MHz	megahertz
	W	watts
	V	volts
Signal Names	Signal names are shown in uppercase. When several signals
	share a common name, an individual signal is represented by

the signal name followed by a number, while the group is represented by the signal name followed by a variable (n). For example, the lower chip-select signals are named CS0#, CS1#, CS2#, and so on; they are collectively called CSn#. A pound symbol (#) appended to a signal name identifies an active-low signal. Port pins are represented by the port abbreviation, a period, and the pin number (e.g., P1.0).

1.3Glossary of Terms and Acronyms

	This section defines conventions and terminology used throughout this document.
Table 1.	Definition	(Sheet 1 of 2)
	Term		Description
			Advanced Digital Display Card – 2nd Generation. This card provides digital display options
			for an Intel Graphics Controller that supports ADD2+ cards. It plugs into a x16 PCI
	ADD2 Card		Express* connector but uses the multiplexed SDVO interface. The card adds Video In
			capabilities to platform. This Advanced Digital Display Card will not work with an Intel
			Graphics Controller that supports DVO and ADD cards. It will function as an ADD2 card in
			an ADD2 supported system, but video in capabilities will not work.
	ACPI		Advanced Configuration and Power Interface
	Core		The internal base logic in the (G)MCH
	DDR2		A second generation Double Data Rate SDRAM memory technology
	DMI		(G)MCH-IntelÆ ICH9 Direct Media Interface
	DVI		Digital Video Interface. Specification that defines the connector and interface for digital
			displays.
	FSB		Front Side Bus. FSB is synonymous with Host or processor bus
	GMA 3100		Intel® Graphic Media Accelerator 3100
			Eighth generation I/O Controller Hub component that contains additional functionality
	IntelÆ ICH9		compared to previous ICHs. The I/O Controller Hub component contains the primary PCI
			interface, LPC interface, USB2, ATA-100, and other I/O functions. It communicates with
			the (G)MCH over a proprietary interconnect called DMI.
	IGD		Internal Graphics Device.
	LVDS		Low Voltage Differential Signaling. A high speed, low power data transmission standard
			used for display connections to LCD panels.

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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—About This Manual

Table 1.	Definition	(Sheet 2 of 2)
	Term		Description
			Advanced Digital Display Card – 2nd Generation. This card provides digital display options
			for an Intel Graphics Controller that supports ADD2+ cards. It plugs into a x16 PCI
	ADD2 Card		Express* connector but uses the multiplexed SDVO interface. The card adds Video In
			capabilities to platform. This Advanced Digital Display Card will not work with an Intel
			Graphics Controller that supports DVO and ADD cards. It will function as an ADD2 card in
			an ADD2 supported system, but video in capabilities will not work.
			Memory Controller Hub component that contains the processor interface, DRAM
	MCH		controller, and x16 PCI Express* port (typically, the external graphics interface). It
			communicates with the I/O controller hub (Intel ICH9) and other I/O controller hubs over
			the DMI interconnect. In this document MCH refers to the Intel® Q35 MCH component.
	MEC		Media Expansion Card, also known as ADD2+ card. Refer to ADD2+ term for description.
			Third Generation input/output graphics attach called PCI Express* Graphics. PCI Express*
	PCI Express*		is a high-speed serial interface whose configuration is software compatible with the
			existing PCI specifications. The specific PCI Express* implementation intended for
			connecting the (G)MCH to an external Graphics Controller is a x16 link and replaces AGP.
			The Primary PCI is the physical PCI bus that is driven directly by the ICH9 component.
	Primary PCI		Communication between Primary PCI and the (G)MCH occurs over DMI. Note that the
			Primary PCI bus is not PCI Bus 0 from a configuration standpoint.
			Serial Digital Video Out (SDVO). SDVO is a digital display channel that serially transmits
			digital display data to an external SDVO device. The SDVO device accepts this serialized
	SDVO		format and then translates the data into the appropriate display format (i.e., TMDS,
			LVDS, TV-Out). This interface is not electrically compatible with the previous digital
			display channel - DVO. For the 82Q965 GMCH, it will be multiplexed on a portion of the
			x16 graphics PCI Express* interface.
	SDVO Device		Third party codec that uses SDVO as an input. May have a variety of output formats,
			including DVI, LVDS, HDMI, TV-out, etc.
			System Management Interrupt. SMI is used to indicate any of several system conditions
	SMI		(such as, thermal sensor events, throttling activated, access to System Management
			RAM, chassis open, or other system state related activity).
			A unit of DRAM corresponding to eight x8 SDRAM devices in parallel or four x16 SDRAM
	Rank		devices in parallel, ignoring ECC. These devices are usually, but not always, mounted on a
			single side of a DIMM.

1.4Support Options

1.4.1Electronic Support Systems

Intel’s site on the World Wide Web (http://www.intel.com/) provides up-to-date technical information and product support. This information is available 24 hours per day, 7 days per week, providing technical information whenever you need it.

Product documentation is provided online in a variety of web-friendly formats at:

(http://developer.intel.com/)

1.4.2Additional Technical Support

If you require additional technical support, please contact your field sales representative or local distributor.

1.5Product Literature

Product literature can be ordered from the following Intel literature centers:

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About This Manual—Intel Core 2 Duo Processor and Intel Q35 Express Chipset

Table 2.	Intel Literature Centers
	Location	Telephone Number
	U.S. and Canada	1-800-548-4725
	U.S. (from overseas)	708-296-9333
	Europe (U.K.)	44(0)1793-431155
	Germany	44(0)1793-421333
	France	44(0)1793-421777
	Japan (fax only)	81(0)120-47-88-32

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Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Development Kit Hardware Features

2.0Development Kit Hardware Features

This chapter describes the features of the Intel® Q35 Development Kit. These recommendations would largely apply to other designs incorporating Intel® Q35 chipset. This documentation should be used in conjunction with the datasheets, specification updates and platform design guides for the Intel® I/O Controller Hub 9 (ICH9) Family and the Intel® Q35 Express Chipset. Contact your Intel representative for the availability of these documents.

2.1Intel® Q35 Express Chipset Development Kit Overview

Figure 1 shows overview of the major features present on the development kit board. Refer to next page for system block diagram of the development kit’s motherboard.

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Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset

Figure 1.

Board Features

Reset button

PCI Slot

PCI Express

x1 Slot

Power Button

SPI EEPROM

(Secondary)

Port 80 LED Display

SPI EEPROM

(Primary)

PCI Express

x16 Graphics

Slot

LGA775 Processor

Socket

Intel® I/O

Controller Hub

(ICH)

SATA Port

Intel® Q35 Memory

Controller Hub (MCH)

2x2 Standard

Power Supply

2x12

Standard

Power Supply

2-DIMM per channel DDR2

2-DIMM per channel DDR2

667/800 (Channel-B)

667/800 (Channel-A)

2.2System Block Diagram

This section will document the common features that are applicable to the Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit. Figure 2 shows a simple block diagram of the development kit.

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